Insert-Molded Pin Array Connector for Stable High-Speed Signal Transmission

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Solution Overview

Problem

High-speed signal transmission connectors face challenges with precise pin pitch maintenance, pin deformation and damage from external forces, impedance changes due to solder rise, and poor electrical connections, leading to system malfunctions and damage to sensitive components.

Innovation Solution

A pin array assembly with upper and lower supports, sealed by insert injection molding, maintains precise pin pitches, prevents solder rise, and relieves stress from external forces, ensuring stable connections and reliable signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the pin pitch is narrowed to increase connector density, then the number of pins per unit area increases, but it becomes difficult to precisely maintain the pitches when mounting pins on the connector body

Engineering Contradiction:
Improvenumber of pins per unit areaVSAvoidpin pitch maintenance precision
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The connector body is divided into an upper connector body and a lower connector body that are coupled together. The pins are mounted on the lower connector body, while the upper connector body provides additional support and positioning structures. This segmentation allows for more flexible manufacturing and assembly processes, enabling precise pin pitch maintenance even as pitch is narrowed.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Positioning protrusions are provided on the pins before mounting, and corresponding positioning recesses are formed in the connector body. These preliminary positioning features ensure that pins are correctly positioned at the precise narrowed pitch during assembly, eliminating the need for complex post-mounting adjustments and ensuring high manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

2Volume of moving object

If the pin size is reduced to achieve higher density, then the connector becomes more compact, but the pins may be bent or deformed even by weak external forces

Engineering Contradiction:
Improveconnector sizeVSAvoidpin resistance to external force
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The connector is segmented into upper and lower bodies, with pins mounted on the lower body. This segmentation allows the pins to be supported by the robust lower connector body structure, providing mechanical strength and resistance to external forces while maintaining the overall compact size of the connector assembly.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The positioning protrusions and recesses create a pre-positioned mechanical interlock that cushions and protects the pins from external forces. This preliminary mechanical protection prevents pins from being bent or deformed by weak external forces during handling and assembly, while the compact pin design maintains small connector volume.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Strength

If SMT soldering is applied to mount the connector on the board, then the connector can be securely attached, but solder rise occurs causing impedance change of the connector pin

Engineering Contradiction:
Improveconnector mounting strengthVSAvoidconnector pin impedance
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The harmful effect of solder rise is extracted and eliminated by using an insert injection molding process for mounting the connector on the board. This alternative mounting method achieves secure attachment without the solder rise problem that would otherwise change the connector pin impedance, thereby maintaining manufacturing precision for high-speed signal transmission.

Inventive Principle:
Principle #2Taking out (Extraction)

4Reliability

If connectors are forcibly coupled to ensure connection, then the connection is established, but the pins themselves may be damaged

Engineering Contradiction:
Improveconnection reliabilityVSAvoidpin integrity
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

Positioning protrusions are provided on the pins before coupling, and corresponding positioning recesses are formed in the connector body. These preliminary positioning features ensure that pins are correctly positioned and engaged during the coupling process, allowing connectors to be coupled reliably without forcing that would damage the pins.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The positioning protrusions and recesses act as intermediary elements that mediate the coupling process. They guide the pins into correct alignment and distribute coupling forces, enabling reliable connection establishment while protecting pin integrity from damage during the coupling operation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures reliable high-speed signal transmission by maintaining precise pin pitches, preventing impedance changes, and protecting against pin deformation and damage, thereby enhancing connector stability and reducing system malfunctions.

Implementation Method 1

a pin array assembly with multiple pins whose pitches are precisely adjusted by insert injection

Methodology Applied
Scientific EffectInsert injection molding:

Data Source

PatentUS12438299B2Pin array assembly and connector for high-speed signal transmission using the same
Publication Date: 2025.10.07 WITHWAVE CO LTD
  • US12438299B2 patent drawing
  • US12438299B2 patent drawing
  • US12438299B2 patent drawing

AI summary

Proposed is a pin array assembly and a connector for high-speed signal transmission using the same and, more particularly, a connector technology in which high-speed signal transmission characteristics are guaranteed by implementing a pin array assembly with multiple pins whose pitches are precisely adjusted by insert injection and a connector capable of relieving stress caused by an external force while applying the pin array assembly.