Insert-Molded Terminal Structure for Insulated Semiconductor Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing insert molding methods face challenges in securing insulation distance and maintaining positional accuracy of terminals due to deformation and positional deviation caused by resin flow during secondary molding, particularly when multiple terminals are integrated.
Innovation Solution
The use of a molding resin part with integrated terminal fitting and pin insertion portions, fixed via primary molding, allows terminals to be securely positioned and insulated during secondary molding, ensuring insulation and reducing labor-intensive terminal insertion processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If terminals are directly fixed in the metal mold during secondary molding, then manufacturing process is simplified, but insulation distance cannot be secured and positional accuracy deteriorates due to resin flow
Solution Approach 1:
The invention divides the terminal fixation process into two independent stages: primary molding where terminals are fixed to a resin part, and secondary molding where the resin part with terminals is fixed to the metal mold. This segmentation allows each stage to optimize for its specific function, preventing resin flow from affecting terminal positioning while maintaining manufacturing efficiency.
Solution Approach 2:
The terminal fitting portions are pre-formed on the resin part during primary molding before secondary molding occurs. This preliminary action ensures terminals are securely positioned and insulated before the secondary molding process, eliminating the need for direct metal mold fixation while maintaining positional accuracy.
2Productivity
If multiple terminals are integrated directly in secondary molding, then productivity increases, but insulation distance cannot be secured due to resin flow
Solution Approach 1:
The invention separates terminal integration from the secondary molding process by completing terminal fixation during primary molding. This allows multiple terminals to be integrated onto the resin part in advance, ensuring insulation distance is maintained while enabling efficient batch processing during secondary molding.
Solution Approach 2:
Multiple terminals are pre-integrated onto the resin part during primary molding before secondary molding. This preliminary integration ensures proper insulation distance between terminals is established before the secondary molding process, while still allowing high-productivity batch manufacturing.
3Device complexity
If terminals are fixed without pre-molded resin member, then device complexity is reduced, but positional accuracy deteriorates due to deformation during molding
Solution Approach 1:
The invention introduces a pre-molded resin part with integrated terminal fitting portions as an intermediate component. While this adds one structural element, it eliminates the need for complex metal mold modifications and ensures consistent terminal positioning, ultimately simplifying the overall manufacturing system.
Solution Approach 2:
The pre-molded resin part with terminal fitting portions serves as an intermediary between the terminals and the metal mold. This mediator ensures accurate terminal positioning and insulation while simplifying the metal mold design, as the mold only needs to accommodate the pre-assembled resin part with terminals.
Data Source
AI summary
A semiconductor module includes an insulated circuit board having an insulating member, a conductive plate arranged on the insulating member, and a semiconductor chip mounted on the conductive plate, and an insert-molded external connection terminal that includes a plurality of terminals, respectively connected to the insulated circuit board, and including a first terminal, and a pre-molded resin member that includes a pre-molded terminal fitting portion and a pre-molded pin insertion portion. The terminal fitting portion is made of a first resin material and has a first groove into which the first terminal is fitted. The pin insertion portion is made of the first resin material and has a hole configured to receive a pin arranged in a cavity of a metal mold used for insert-molding of the external connection terminal.