Insertable Memory Device PCB for Thermal Dissipation
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Solution Overview
Problem
In current computing systems, the tight spacing between memory devices on printed circuit boards (PCBs) complicates thermal dissipation, especially for high-density dual in-line memory modules (DIMM), as conventional solutions do not adequately address the thermal management needs.
Innovation Solution
The memory device configuration includes a first PCB with memory modules and additional layers attached to the sides, forming an insertable portion with a reduced thickness that fits into a connector slot, creating a wider air gap for improved thermal dissipation and incorporating capacitance compensation features to enhance signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If memory devices are placed with tight spacing on PCB to increase density, then productivity and device density are improved, but thermal dissipation capability deteriorates
Solution Approach 1:
The patent reduces the thickness of the PCB in the vertical dimension (Z-axis) to create additional air gap space. This dimensional change allows for improved thermal dissipation without increasing the horizontal footprint, thereby maintaining high device density while addressing thermal management challenges through vertical space optimization.
Solution Approach 2:
The patent changes the physical parameter of PCB thickness by attaching additional layers to form an insertable portion with reduced thickness. This parameter modification creates wider air gaps between memory devices, enhancing thermal dissipation capability while preserving the tight horizontal spacing required for high density configurations.
2Temperature
If PCB thickness is reduced to create wider air gaps for thermal dissipation, then thermal management is improved, but connector slot compatibility may be affected
Solution Approach 1:
The patent segments the PCB structure by attaching separate layers (such as FPC or rigid PCB layers) to form an insertable portion. This segmentation allows the thermal management function (reduced thickness for air gaps) to be separated from the connector interface function, enabling compatibility with existing connector slots while achieving improved thermal dissipation.
Solution Approach 2:
The patent introduces an intermediate insertable portion consisting of attached layers that acts as a mediator between the main PCB and the connector slot. This intermediate structure provides the reduced thickness needed for thermal dissipation while maintaining the mechanical and electrical interface requirements for connector slot compatibility.
3Productivity
If tight spacing is maintained between memory devices, then device density is improved, but signal integrity deteriorates due to increased crosstalk
Solution Approach 1:
The patent addresses signal integrity issues by reducing PCB thickness in the vertical dimension, which increases spacing between signal traces on adjacent devices. This dimensional change reduces electromagnetic coupling and crosstalk between closely spaced memory devices, thereby improving signal integrity while maintaining high horizontal device density.
Data Source
AI summary
Embodiments of the present disclosure are directed towards a memory device insertable into a PCB, e.g., a motherboard of a computing device. In some embodiments, the memory device may include a first PCB having a first thickness, to house one or more memory modules disposed on at least one side of the first PCB. The memory device may further include a layer having a second thickness, which may be attached to the side of the first PCB in an area that is proximate to an edge of the first PCB, to form a memory device portion that may be insertable into a connector slot disposed on a second PCB. The insertable portion may have a thickness that comprises the first and second thicknesses, to fit into the connector slot of the second PCB. Other embodiments may be described and/or claimed.