In-Situ 3D X-Ray Inspection for Subsurface AM Defect Detection
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Solution Overview
Problem
Current additive manufacturing systems, particularly those using electron-beam melting, face challenges in detecting defects within the inner volumes of components due to limited penetration depth of x-rays, leading to incomplete inspection of subsurface features like voids and porosity.
Innovation Solution
The implementation of an in-situ inspection system that utilizes x-ray backscattering, where an electron beam generates a multidirectional x-ray flux directed through a pinhole to penetrate the component, allowing a detector to capture three-dimensional spatial coordinates of defects, enabling early detection and correction during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional x-ray inspection methods are used, then the inspection system is simple and easy to implement, but the penetration depth is limited and subsurface defects cannot be detected
Solution Approach 1:
The patent transitions from conventional two-dimensional x-ray imaging to three-dimensional defect detection by utilizing backscattered electrons to obtain depth information. The system reconstructs 3D coordinates (x, y, z) of defects by combining lateral position information from x-ray detectors with depth information from electron backscatter patterns, enabling detection of subsurface defects that conventional 2D methods cannot detect.
Solution Approach 2:
The patent introduces backscattered electrons as an intermediary mechanism to bridge the gap between x-ray detection and depth measurement. The electrons interact with the sample and provide depth information through backscatter patterns, while x-rays provide lateral position information. This intermediary approach enables 3D defect localization without requiring complex large-scale imaging systems.
2Area of stationary object
If large-scale imaging systems are used to inspect large components, then complete inspection coverage is achieved, but the system size and cost increase significantly
Solution Approach 1:
The patent segments the inspection process into localized 3D defect detection events rather than requiring a single large-scale imaging system to capture the entire component. The system can inspect large components by scanning or moving the electron beam and detectors across different regions, reconstructing 3D defect information from multiple localized measurements. This approach achieves complete inspection coverage without requiring a proportionally large imaging system.
3Measurement precision
If post-inspection methods are used, then comprehensive defect analysis is possible, but time and cost are significantly increased
Solution Approach 1:
The patent performs defect detection and 3D localization during the additive manufacturing process itself, before the component is completed and removed for post-inspection. By integrating the electron beam-based detection system into the manufacturing process, the system detects defects in real-time, allowing for immediate identification and potential correction while the component is still being built, thereby eliminating the need for time-consuming post-inspection procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the quality and yield of additive manufacturing by allowing for real-time detection and correction of defects, reducing post-inspection costs and time, and is applicable to large components without the need for surface finishing or large-scale imaging systems.
Implementation Method 1
an electron beam source configured to emit an electron beam such that the electron beam penetrates the component... a target positioned along the electron beam path between the electron beam source and the component such that interaction between the target and the electron beam generates a multidirectional x-ray flux
Implementation Method 2
the multidirectional x-ray flux is directed through the pinhole toward the component positioned with respect to the angle to direct an x-ray flux onto the component... at least one detector positioned to detect x-ray radiation from the x-ray flux that penetrates the component
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
The present disclosure is directed to an additive manufacturing system (100) configured to generate an electron beam (105) directed toward a target (120) to generate multidirectional x-ray flux (108). The multidirectional x-ray flux (108) is directed toward a component (126) as x-ray flux (109) after being directed through at least one plate (122) defining a pinhole (124) therethrough . Interactions between the component (126) and the x-ray flux (109) generate x-ray radiation (111). At least one detector (128) is configured to detect the x-ray radiation (111). An analysis component (190) is configured to generate an image comprising a three-dimensional component based on the x-ray radiation (111) detected by the at least detector (128).