In Situ Electroplating for Bulk Metal Conductivity
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Solution Overview
Problem
Direct Write manufacturing techniques face limitations due to the low conductivity of printed materials and the inefficiencies of current curing methods, particularly for large structural substrates with complex geometries, which restrict the application of bulk metal properties and require costly and time-consuming registration and curing processes.
Innovation Solution
A method combining Direct Write techniques with electroplating to create a conductive pattern on a substrate, using a surface treatment to form a partially conducting seed layer that allows for in situ electroplating without the need for a bath or oven, enabling the deposition of conductive materials with bulk metal properties directly on complex surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional Direct Write inks are used, then the process is simple and cost-effective, but the electrical conductivity is much less than bulk metal wire (only a few percent of bulk metal conductivity)
Solution Approach 1:
The patent applies composite materials by combining a Direct Write ink layer with electroplated metal layers. The ink serves as a seed layer containing metal particles that provide nucleation sites for electroplating, creating a composite structure that achieves bulk metal conductivity while maintaining the additive manufacturing benefits of Direct Write technology.
2Reliability
If thermal curing in an oven is used, then the ink can be consolidated, but large substrates require multiple costly and time-consuming removal and realignment steps
Solution Approach 1:
The patent segments the curing process by implementing localized in-situ curing zones within the electroplating bath. Different regions of the substrate can be cured independently and simultaneously, eliminating the need for complete substrate removal and realignment. This allows continuous processing of large substrates without the time-consuming cycles associated with traditional oven curing.
Solution Approach 2:
The patent introduces an intermediary curing mechanism that operates within the electroplating bath itself, using controlled heating elements or electromagnetic fields to cure the ink locally. This intermediary curing system eliminates the need for separate oven processing, allowing the substrate to remain in place throughout the entire manufacturing process.
3Reliability
If thermal curing is used, then the ink can be fixed, but the curing temperature is limited by the substrate operating temperature, compromising ink performance
Solution Approach 1:
The patent changes the curing parameters by implementing controlled localized heating within the electroplating bath. Instead of relying on substrate-operating-temperature-limited oven curing, the system uses targeted thermal or electromagnetic energy to achieve higher curing temperatures only in the ink deposition zones, temporarily exceeding the substrate's normal operating temperature without causing damage. This allows the ink to reach optimal curing conditions while the substrate remains within its operational temperature range during service.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the deposition of conductive layers with bulk metal properties on complex substrates without the need for immersion in a bath or oven, improving conductivity and reducing processing time and costs, while allowing for precise control over the thickness and accuracy of the conductive layers.
Implementation Method 1
electroplating onto the patterned area by means of a tool comprising a first electrode and an electrolyte source for in situ supply of electrolyte, by providing an anode current to the first electrode, causing the patterned area at least in the vicinity of the tool to function as a cathode, and passing electrolyte between said patterned area and said first electrode, thereby to deposit conductive material onto said patterned area
Implementation Method 2
induction heating means for positioning adjacent said region such as to heat said region by electromagnetic inductive effects
Data Source
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AI summary
A method of and apparatus for forming components on a substrate. The method comprise in a first step applying a surface treatment to said substrate to form a patterned area having at least some electrical conductivity; in a second step electroplating onto the patterned area by means of a tool comprising a first electrode and a source for in situ supply of electrolyte, by providing an anode current to the first electrode, causing the patterned area at least in the vicinity of the tool to function as a cathode, and passing electrolyte between said patterned area and said first electrode, thereby to deposit conductive material onto said patterned area. The apparatus implements the method. Conductive material may be built up to an extent that the component so formed approximates to the bulk properties of the conductive material. The surface treatment itself therefore is not required to create good conduction properties.