In-Situ Spin Logic Fabrication via Vacuum Deposition

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Solution Overview

Problem

Existing spin logic devices face low spin injection efficiency due to air breaks during deposition, leading to surface oxidization and poor interface quality, which complicates integration into High Volume Manufacturing processes.

Innovation Solution

An in-situ processing method that deposits magnet and channel materials sequentially in the same vacuum chamber without air exposure, preserving the interface quality and eliminating the need for multi-angle deposition, thereby preventing oxidization and ensuring a continuous thermodynamic or crystallographic conditioning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If air break is used during deposition of spin injection layers, then patterning can be performed, but surface oxidization occurs and interface quality deteriorates

Engineering Contradiction:

Improvepatterning capabilityVSAvoidinterface quality

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent performs all deposition processes including patterning within a continuous vacuum environment, eliminating air exposure that causes oxidization. The vacuum chamber serves as an inert atmosphere that protects the magnetic layers and interfaces from degradation while enabling complete fabrication without breaking vacuum.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent maintains continuous vacuum deposition throughout the entire fabrication process without air breaks. All layers including spin injection layers are deposited sequentially in the same vacuum chamber, ensuring continuous thermodynamic and crystallographic conditioning that preserves interface quality and prevents oxidization.

Inventive Principle:

Principle #20Continuity of useful action

2Adaptability or versatility

If multi-angle deposition with mask-in-chamber flow is used, then different geometries can be obtained, but process complexity increases and integration into HVM becomes difficult

Engineering Contradiction:

Improvegeometry flexibilityVSAvoidprocess complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Instead of using complex multi-angle deposition with masks to create patterns, the patent inverts the approach by depositing complete multi-layer structures first and then using standard planar lithography and etching techniques to define geometries. This simplifies the deposition process while maintaining geometric flexibility through subsequent patterning steps.

Inventive Principle:

Principle #13The other way round (Inversion)

3Ease of manufacture

If conventional deposition processes are used, then fabrication can be performed, but spin injection efficiency remains low due to rough interfaces

Engineering Contradiction:

Improvefabrication capabilityVSAvoidspin injection efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The continuous vacuum environment prevents oxidization and maintains clean interfaces between magnetic layers, resulting in smooth interfaces that enable high spin injection efficiency. The inert vacuum atmosphere eliminates contaminants that would otherwise degrade interface quality and reduce spin injection performance.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

Continuous deposition without air breaks maintains consistent thermodynamic and crystallographic conditions throughout the process, producing high-quality interfaces with atomic-level smoothness. This continuity ensures optimal spin injection efficiency by preventing interface roughness that would scatter spin-polarized electrons.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances spin injection efficiency by maintaining the quality of the magnetic-channel interface, enabling the production of high-quality spin logic devices suitable for integration into advanced manufacturing processes and various magnetic logic and sensing applications.

Implementation Method 1

forming a magnet on a substrate or a template... and forming a first layer of non-magnet conductive material on the interface of the magnet such that the magnet and the layer of non-magnet conductive material are formed in-situ

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Data Source

PatentUS10600957B2Method for fabricating spin logic devices from in-situ deposited magnetic stacks

Publication Date: 2020.03.24 INTEL CORP

AI summary

Described is a method comprising: forming a magnet on a substrate or a template, the magnet having an interface; and forming a first layer of non-magnet conductive material on the interface of the magnet such that the magnet and the layer of non-magnet conductive material are formed in-situ. Described is an apparatus comprising: a magnet formed on a substrate or a template, the magnet being formed under crystallographic, electromagnetic, or thermodynamic conditions, the magnet having an interface; and a first layer of non-magnet conductive material formed on the interface of the magnet such that the magnet and the layer of non-magnet conductive material are formed in-situ.