In-situ Thermal Margining for Computer System Reliability Testing
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Solution Overview
Problem
Conventional temperature-dependent reliability testing of computer systems requires shipping units to a testing facility, limiting real-time monitoring and providing only pass/fail information without identifying exact failure times or temperature profiles, which hinders accurate long-term reliability projections.
Innovation Solution
A system dynamically controls the temperature profile within a computer system by generating a load profile based on a desired temperature profile, using a feedback and control loop to adjust operations and monitor internal temperatures, allowing for in-situ temperature cycling and real-time failure detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal chamber testing is used to cycle temperature for reliability evaluation, then temperature-dependent failure mechanisms are accelerated, but the system requires shipping to external facilities and cannot perform real-time monitoring
Solution Approach 1:
The computer system performs its own temperature cycling by generating internal computational loads that cause temperature variations, eliminating the need for external thermal chambers. The system monitors its own temperature and executes load profiles autonomously, enabling self-service reliability testing without external facilities.
Solution Approach 2:
A temperature control system acts as an intermediary between the computational loads and the computer system components. This intermediary monitors temperature via telemetry and adjusts load profiles to achieve desired temperature cycling patterns, enabling controlled temperature-dependent stress testing without external thermal chambers.
2Temperature
If external thermal chamber testing is used, then temperature cycling can be controlled, but only pass/fail information is obtained without exact failure times
Solution Approach 1:
A feedback loop continuously monitors computer system telemetry data including temperature, performance metrics, and operational status. This feedback enables real-time detection of failures and degradation, providing exact failure times and progression data that were previously unavailable in thermal chamber testing.
Solution Approach 2:
The patent replaces the mechanical thermal chamber system with a software-based load generation and monitoring system. By using computational loads and software-controlled telemetry monitoring, the system achieves both temperature control and continuous failure detection, substituting mechanical infrastructure with software-based solutions.
3Loss of information
If in-situ temperature cycling is implemented, then real-time monitoring is enabled, but complex load profile generation and temperature control is required
Solution Approach 1:
The temperature control system performs multiple functions: it generates computational loads, monitors temperature via telemetry, detects failures, and adjusts load profiles dynamically. This multi-functional system reduces overall complexity by consolidating what would otherwise require separate external facilities and monitoring systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time monitoring of temperature-dependent failures and accurate identification of failure times, facilitating more precise long-term reliability projections and reducing logistical and operational costs associated with traditional thermal chamber testing.
Implementation Method 1
generating a load profile for the computer system based on the desired temperature profile... executing the load profile to generate computer system activity, wherein the computer system activity causes the desired temperature profile
Data Source
AI summary
Embodiments of the present invention provide a system that dynamically controls a temperature profile within a computer system by generating computer system activity. The system starts by receiving a desired temperature profile. The system then generates a load profile based on the desired temperature profile, wherein the load profile specifies operations to be performed by the computer system. The system next executes the load profile on the computer system to generate computer system activity, wherein the computer system activity causes the desired temperature profile in the computer system.


