Inspection Apparatus Placing Device Temperature Control
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Solution Overview
Problem
The existing inspection apparatuses face challenges in adjusting the temperature of the placing table during high heat generation rates of electronic devices, especially when the position adjusting mechanism is separated from the placing device, as they rely solely on heating devices and lack sufficient heat dissipation capabilities.
Innovation Solution
The inspection apparatus incorporates a placing device with a mica heater and a heat sink having prominences and depressions, allowing for efficient temperature adjustment and heat dissipation without the need for high-price cooling devices, even when the placing device and position adjusting mechanism are separated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater is provided in the placing device to adjust temperature, then temperature control capability is improved, but heat dissipation capability deteriorates when the position adjusting mechanism is separated from the placing device
Solution Approach 1:
The placing device is divided into two functional zones: a holding target portion that maintains thermal contact with the position adjusting mechanism for heat dissipation, and a non-holding portion that provides heat dissipation surface area. This segmentation allows simultaneous temperature control and heat dissipation despite separation of the placing device from the position adjusting mechanism during inspection.
Solution Approach 2:
Different portions of the placing device are given different thermal properties. The holding target portion is designed to maintain thermal contact for active heat dissipation, while other portions provide additional heat dissipation surface area. This local differentiation optimizes both temperature control and heat dissipation capabilities in their respective zones.
2Measurement precision
If the placing device is separated from the position adjusting mechanism during inspection, then inspection accuracy is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The placing device structure is segmented into a holding target portion that maintains thermal connection and other portions that provide heat dissipation surface. This allows the placing device to be separated from the position adjusting mechanism for accurate inspection while maintaining heat dissipation capability through the specially designed structure.
Solution Approach 2:
The holding target portion acts as an intermediary that maintains thermal connection between the placing device and the position adjusting mechanism even when they are physically separated. This intermediary structure enables heat dissipation to continue during inspection without compromising measurement accuracy.
3Loss of energy
If expensive cooling devices are used to dissipate heat during high heat generation rates, then heat dissipation capability is improved, but device cost increases
Solution Approach 1:
The placing device structure itself provides heat dissipation functionality through its specially designed holding target portion and heat dissipation surface. This self-service approach eliminates the need for separate expensive cooling devices, as the placing device performs both its primary function and heat dissipation function.
Solution Approach 2:
The placing device is designed to perform multiple functions: holding the inspection target, providing temperature control, and dissipating heat. The holding target portion and heat dissipation surface enable the placing device to serve as both a positioning platform and a heat dissipation system, replacing the need for dedicated cooling equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective temperature control of the placing device, ensuring accurate temperature adjustment and efficient heat dissipation during high heat generation rates, without the need for expensive cooling devices, thus maintaining the quality of electrical characteristic inspections.
Implementation Method 1
a heater provided in the placing device and configured to adjust a temperature of the placing device
Implementation Method 2
a heat sink having prominences and depressions is provided at a portion of the placing device except a holding target portion thereof
Data Source
AI summary
An inspection apparatus configured to inspect a target object includes a placing device configured to place the target object thereon; a heater provided in the placing device and configured to adjust a temperature of the placing device; and a position adjusting mechanism configured to hold the placing device on which the target object is placed, and configured to perform a position adjustment between the target object placed on the placing device and a terminal to be brought into contact with the target object when an inspection of an electrical characteristic is performed. The placing device is configured to be separated from the position adjusting mechanism when the inspection of the electrical characteristic is performed. A heat sink having prominences and depressions is provided at a portion of the placing device except a holding target portion thereof which is to be held by the position adjusting mechanism.