Inspection Component With Multi-Height Pressing Surface

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Solution Overview

Problem

Existing inspection systems for semiconductor devices require multiple types of inspection components to accommodate semiconductor devices of different thicknesses, leading to increased costs due to the need for multiple component replacements.

Innovation Solution

A semiconductor device design featuring a sealing resin portion with a first region of a specific thickness and a second region thinner than the first region, allowing a single inspection component to effectively press and inspect semiconductor devices of varying thicknesses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple types of inspection components are used to accommodate semiconductor devices of different thicknesses, then the inspection can be performed on all device types, but the cost increases due to the need for multiple component replacements

Engineering Contradiction:

Improveability to inspect different device thicknessesVSAvoidnumber of inspection components

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The inspection component is designed with a pressing surface that can accommodate semiconductor devices of multiple thicknesses through a single component type. The component includes a base and a pressing surface arranged at different heights, allowing one inspection component to serve multiple functions for different device thicknesses, thereby eliminating the need for multiple specialized components and reducing replacement costs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple types of inspection components are used to accommodate semiconductor devices of different thicknesses, then all device types can be inspected, but the inspection efficiency decreases due to frequent component replacements

Engineering Contradiction:

Improveability to inspect different device thicknessesVSAvoidinspection efficiency

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Device complexity

If a single inspection component is used for all device thicknesses, then the cost is reduced, but the component must be designed to accommodate varying thicknesses which increases design complexity

Engineering Contradiction:

Improvenumber of inspection componentsVSAvoiddesign complexity of single component

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

The inspection component is divided into distinct functional regions: a base portion and a pressing surface portion arranged at different heights. This segmentation allows the single component to accommodate devices of varying thicknesses by engaging different portions of the same component structure, simplifying the design while maintaining versatility.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different portions of the inspection component are designed with specific local characteristics - the base provides structural support while the pressing surface provides the inspection function. This local differentiation within the single component allows it to handle multiple device thicknesses without requiring multiple separate components, balancing design complexity with manufacturing ease.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12298342B2Semiconductor device, inspection component, and inspection device

Publication Date: 2025.05.13 KIOXIA CORP

AI summary

According to one embodiment, a semiconductor device includes a board, a plurality of external connection terminals, a semiconductor component, and an insulator. The board includes a first surface and a second surface. The second surface is located on a side opposite to the first surface. The plurality of external connection terminals is on the first surface. The semiconductor component is located on a side opposite to the plurality of external connection terminals with respect to the board. The insulator includes a first region and a second region. The first region has a first thickness in a thickness direction of the board. The second region is located on an outer peripheral side of the first region and has a second thickness thinner than the first thickness in the thickness direction. The insulator covers the semiconductor component from a side opposite to the board.