Inspection Device Reconstructs Cross-Sectional Shapes via Spectral Pattern Analysis
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Solution Overview
Problem
Existing inspection devices face challenges in accurately reconstructing cross-sectional processed shapes of samples with fine hole patterns without destruction, particularly in dry etching processing, due to limitations in measuring and analyzing the ion flux and etching depth.
Innovation Solution
An inspection device comprising a measurement unit and a controller that uses a shape function to predict and reconstruct cross-sectional shapes by comparing measured spectral patterns with calculated patterns, adjusting parameters to achieve high accuracy and robustness, employing a shape function that indicates ion flux amounts based on etching depth and ion emission-directionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional measurement methods are used to measure physical quantities for samples with fine hole patterns, then measurement can be performed, but reconstruction accuracy of cross-sectional processed shape deteriorates
Solution Approach 1:
The invention changes the approach from directly measuring physical quantities to measuring spectral patterns and then reconstructing the cross-sectional shape through parameter optimization. The controller adjusts parameters in the shape function to match measured spectral patterns with calculated spectral patterns, thereby improving reconstruction accuracy without directly measuring difficult physical quantities
Solution Approach 2:
The invention replaces direct physical measurement of ion flux and etching depth with a computational approach using spectral pattern analysis. Instead of mechanically measuring the cross-sectional shape, the system uses optical/spectral measurements combined with mathematical reconstruction algorithms to achieve high-accuracy three-dimensional shape recovery
2Measurement precision
If physical destruction is used to measure cross-sectional shapes, then direct measurement is possible, but sample destruction occurs and development time increases
Solution Approach 1:
The invention creates a virtual model (calculated spectral pattern) that copies the characteristics of the actual sample by using a shape function to represent the cross-sectional shape. This virtual model allows measurement and analysis without physically destroying the sample, enabling repeated measurements and faster development cycles
Solution Approach 2:
The invention introduces spectral patterns as an intermediary between the physical sample and the cross-sectional shape measurement. Instead of directly measuring the cross-sectional shape (which would require destruction), the system measures spectral patterns and uses them as intermediate data to reconstruct the three-dimensional shape through parameter optimization
Data Source
AI summary
According to one embodiment, there is provided an inspection device including a measurement unit and a controller. The measurement unit measures a physical quantity in accordance with a predetermined pattern for a sample with the predetermined pattern, and generates a first spectral pattern in accordance with a measurement result. The controller predicts a processed cross-sectional shape by applying a parameter to a shape function indicating an ion flux amount in accordance with an etching depth in a case where the predetermined pattern is processed in dry etching processing, determines a second spectral pattern in accordance with the processed cross-sectional shape that has been predicted, adjusts the parameter while comparing the first spectral pattern with the second spectral pattern, and reconstructs the processed cross-sectional shape of the sample in accordance with an adjustment result.