Inspection Jig With Expanded Wire Intervals For Probe Connection
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Solution Overview
Problem
The increasing density and number of inspection points on substrates, such as semiconductor wafers, require a more efficient method to connect probes to inspection devices, as conventional methods struggle with the fine pitch and large number of probes, necessitating a solution to expand electrode intervals for reliable connection.
Innovation Solution
An inspection jig comprising film-shaped wiring substrates with exposed electrodes and a pedestal that supports these substrates, allowing probes to extend and connect to the inspection device body with expanded wire intervals, facilitating reliable electrical contact and inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If probes are arranged at fine intervals to match inspection points, then measurement precision is improved, but connection reliability deteriorates due to inability to directly connect to inspection device body
Solution Approach 1:
The patent introduces a conversion block as an intermediary component between the probe array and inspection device body. This conversion block includes first electrodes arranged at fine intervals to contact probe rear ends, and second electrodes arranged at wider intervals for connection to the inspection device body, with wires connecting these electrode groups. This mediator resolves the contradiction by enabling both fine probe spacing and reliable connection to the inspection device.
Solution Approach 2:
The patent transitions from a two-dimensional arrangement where probes directly connect to the inspection device to a three-dimensional structure using stacked connection substrates. The conversion block uses multiple layers (first connection substrate, second connection substrate, third connection substrate) with vias penetrating through layers, creating vertical connections that expand the interval between second electrodes while maintaining fine probe spacing at the top surface.
2Adaptability or versatility
If conversion block uses multiple laminated connection substrates with expanding via intervals, then adaptability is improved, but manufacturing precision deteriorates due to requirement for precise lamination
Solution Approach 1:
The patent forms all via holes and wire connections between electrodes on each connection substrate before lamination. By completing the electrical connections preliminarily on individual substrates, the patent reduces the precision requirements during the lamination process itself, as the critical wire bonding and via formation are already completed on separate, manageable substrates rather than requiring precise alignment during assembly.
Data Source
AI summary
An inspection jig includes: film-shaped wiring substrates each having one surface provided with an electrode; a pedestal that supports the wiring substrates which are laminated such that electrode regions are exposed, the electrode region being a region where the electrode is provided in each of the wiring substrates; and a plurality of probes which have base end portions in contact with the electrode regions and extend in a direction away from the electrode regions.