Inspection Jig Inclination Absorption for Uniform Contact Pressure
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Solution Overview
Problem
Conventional inspection jigs for semiconductor wafers face challenges in maintaining uniform contact pressure across a large number of devices, leading to weak or excessive contact pressures due to potential jig inclination, which can result in inaccurate electrical characteristic inspections.
Innovation Solution
The inspection jig design includes a flexible substrate with a contact portion and a block that can be inclined using a first pin as a fulcrum, allowing for uniform contact by adjusting the block's position through a combination of large and small diameter portions within a positioning hole, enabling absorption of inclination and maintaining accurate positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the block is positioned using pins to ensure positioning accuracy, then positioning precision is improved, but the block cannot move except in the axial direction and cannot absorb inclination
Solution Approach 1:
The block is designed with a positioning hole that allows it to rotate about a pin while maintaining axial positioning. This dynamic capability enables the block to absorb inclination by rotating to an appropriate angle, while the pin ensures the block remains axially positioned at the correct location.
Solution Approach 2:
The positioning hole is divided into two functional sections: an upper section that guides axial positioning and a lower section that permits rotational movement. This segmentation allows the block to maintain positioning accuracy while gaining the freedom to absorb inclination through rotation.
2Productivity
If the contact portion area is increased to inspect more devices simultaneously, then productivity is improved, but contact pressure becomes biased and weak spots are generated
Solution Approach 1:
The block's ability to rotate about the pin allows it to dynamically adjust its orientation to compensate for jig inclination. This ensures that even when the contact portion area is large, the contact pressure remains uniformly distributed across all inspection locations.
Solution Approach 2:
The block's rotational degree of freedom allows it to change its angular parameter to absorb inclination, thereby maintaining uniform contact pressure distribution across the enlarged contact portion area.
3Reliability
If overall contact pressure is increased to compensate for weak contact locations, then contact reliability is improved, but excessive contact pressure may crush solder balls
Solution Approach 1:
The block rotates to an appropriate angle to absorb inclination, which naturally distributes contact pressure uniformly across all contact locations. This eliminates the need to increase overall contact pressure to compensate for weak spots, thereby preventing excessive pressure that could crush solder balls.
Data Source
AI summary
An inspection jig includes a flexible substrate, a block, a pressing member, and a first pin fixed to the pressing member. The block has a first positioning hole opened in a substantially center portion of an opposite surface of a main surface thereof. The first pin is inserted into the first positioning hole. A large diameter portion and a small diameter portion are provided in an inner peripheral side of the first positioning hole. A diameter of the large diameter portion is smaller than a diameter of the large diameter portion. The large diameter portion is formed so as not to contact the first pin when the block is not inclined. The block is configured to be inclined with the first pin as a fulcrum.