Inspection Jig Parallel Board Holding Mechanism
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional inspection jigs for printed boards face issues with stable electrical contact due to board bending under pressing force, and increased inspection points lead to displacement and instability in semiconductor wafer inspections, affecting the accuracy and reliability of the inspection process.
Innovation Solution
An inspection jig design featuring a first board and a second board in parallel, with an electrical connection portion and a board holding portion that sandwiches the connection between them, ensuring stable electrical contact and minimizing board displacement, and a probe unit that detects signals from the board, allowing for accurate inspections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electrical connection member such as a pogo pin unit is brought into contact with the board to electrically connect the board and the pogo pin unit, then electrical connection is achieved, but the board may be bent by receiving a pressing force, causing defects in electrical contact
Solution Approach 1:
A holding plate is introduced as an intermediary component between the pogo pin unit and the board. The holding plate receives the pressing force from the pogo pin unit and transmits it to the board, acting as a force-distributing mediator that prevents direct concentrated loading on the board, thereby avoiding board bending while maintaining electrical contact stability
Solution Approach 2:
The holding plate is positioned and prepared in advance to support the board before the pogo pin unit applies pressing force. By pre-establishing this support structure, the board is prevented from bending when the electrical connection is made, ensuring stable electrical contact from the outset
2Productivity
If the number of probes included in the inspection jig is increased to inspect more inspection points, then inspection coverage is improved, but the force in the thickness direction applied to the board from the probe increases, causing the board to be displaced
Solution Approach 1:
The holding plate serves as a mediator between the multiple probes and the board. It distributes the collective force from numerous probes across its larger surface area, preventing the board from being displaced in the thickness direction while still enabling comprehensive inspection coverage through increased probe count
Solution Approach 2:
The holding plate distributes the concentrated vertical force from multiple probes by spreading it across a two-dimensional surface area. This dimensional transformation converts point loads into distributed area loads, reducing the force density on any single point of the board and preventing displacement
3Reliability
If the board is held in a state where the first board and the second board are electrically connected via the electrical connection portion by sandwiching the electrical connection portion, then stable electrical connection is achieved, but the structure becomes more complex
Solution Approach 1:
The holding plate performs multiple functions simultaneously: it provides mechanical support to prevent board bending, distributes applied forces, and maintains the electrical connection between the first and second boards. By consolidating these functions into a single component, the overall structural complexity is reduced while achieving stable electrical connection
Data Source
AI summary
An inspection jig includes a first board, a probe unit including a probe, a second board located in parallel with the first board and electrically connected to the probe, an electrical connection portion electrically connecting the first board and the second board, and a board holding portion holding the second board in parallel with the first board in the thickness direction and holding the probe unit. The board holding portion includes a probe-side holding plate located on the probe unit side of the second board and a holding plate support portion that positions the probe-side holding plate at a position where the probe-side holding plate is in parallel with the first board in the thickness direction. The board holding portion holds the second board so that the first board and the second board are electrically connected via the electrical connection portion being sandwiched between the first board and second board.