Inspection Apparatus LED Heating Uniformity Control
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Solution Overview
Problem
Existing inspection apparatuses face challenges in achieving uniform temperature control across electronic devices during testing, leading to non-uniform heat distribution and inefficient heat dissipation.
Innovation Solution
The inspection apparatus employs a light irradiator with partitioned LEDs and a coolant system to control temperature, switching between uniform and peripheral light irradiation based on detected heat generation, ensuring in-plane temperature uniformity and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If uniform light irradiation is applied across the entire electronic device, then temperature uniformity is improved, but power consumption increases
Solution Approach 1:
The patent applies local quality by dividing the LED irradiation into different regions (central region and outer peripheral region) with different control strategies. The central region receives continuous irradiation to maintain temperature uniformity, while the outer peripheral region receives irradiation only when heat accumulation is detected, thereby reducing overall power consumption while maintaining necessary temperature control.
Solution Approach 2:
The patent implements dynamic control by continuously monitoring temperature distribution across the electronic device and adjusting LED irradiation patterns in real-time. The control unit switches between different irradiation modes (central-only, peripheral-only, or combined) based on detected heat accumulation patterns, optimizing power consumption while maintaining temperature uniformity as needed.
2Loss of energy
If LED irradiation is applied to the outer peripheral region, then heat dissipation is improved, but power consumption increases
Solution Approach 1:
The patent applies partial action by activating LED irradiation in the outer peripheral region only when and where heat accumulation is detected, rather than continuously irradiating the entire device. This selective, condition-based approach improves heat dissipation efficiency only when needed, avoiding unnecessary power consumption during normal operating conditions.
Solution Approach 2:
The patent implements feedback control by using temperature sensors to monitor heat accumulation in the outer peripheral region and using this information to control LED irradiation. When heat accumulation exceeds a threshold, the control unit activates peripheral LED irradiation to enhance heat dissipation, and deactivates it when the threshold is no longer exceeded, optimizing the balance between heat dissipation and power consumption.
3Stability of the object's composition
If continuous LED irradiation is used for temperature control, then temperature stability is improved, but power consumption increases
Solution Approach 1:
The patent implements periodic action by controlling LED irradiation in the outer peripheral region based on periodic temperature monitoring and heat accumulation detection. Instead of continuous irradiation, LEDs are activated only during periods when heat accumulation is detected and deactivated when temperature stability is maintained, reducing power consumption while preserving temperature stability when needed.
Solution Approach 2:
The patent applies dynamic control by continuously monitoring temperature distribution and adjusting LED irradiation patterns in real-time. The control unit switches between different irradiation modes (central-only, peripheral-only, or combined) based on detected heat accumulation patterns, optimizing power consumption while maintaining temperature stability as needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances temperature uniformity across electronic devices during testing, improving heat dissipation and reducing power consumption by adjusting light distribution based on heat generation patterns.
Implementation Method 1
a light irradiator that irradiates light to an electronic device on the wafer
Implementation Method 2
controlling in-plane uniformity of temperature of the electronic device by irradiating light from the light irradiator
Implementation Method 3
a coolant flow path through which a coolant flows in the substrate support
Implementation Method 4
Temperatures of the electronic devices are controlled by a cooling mechanism or a heating mechanism in the substrate support
Implementation Method 5
the electronic device generates heat due to a current supplied to the electronic device
Data Source
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AI summary
An inspection apparatus includes a stage (11) on which a substrate (W) having an inspection target (500) is placed, a probe card (15), a light irradiator (40), and a controller (19). The probe card has probes (16) that supply a current to the inspection target. The light irradiator irradiates light to heat the substrate. The controller controls the light irradiator to excecute uniformly heating the inspection target by the light from the light irradiator, and heating an outer peripheral portion (402) of the inspection target by the light from the light irradiator.