Semiconductor Pattern Inspection Map Layout to Avoid Redundant Measurements
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Solution Overview
Problem
The increasing complexity and fineness of semiconductor patterns make existing inspection methods more time-consuming and less reliable, leading to difficulties in detecting defects during semiconductor fabrication.
Innovation Solution
An inspection method and system that generates a third measurement map by selecting a second measurement region at the center of overlapping preliminary measurement regions, reducing the number of measurement regions and avoiding duplicate inspections, allowing for faster and more reliable pattern inspection on semiconductor substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple preliminary measurement regions are provided on corresponding measurement points, then measurement coverage is improved, but inspection time increases due to redundant overlapping measurements
Solution Approach 1:
The patent merges overlapping measurement regions by grouping preliminary measurement regions that overlap in the two-dimensional plan view into a single polygon, then selecting one representative second measurement region at the center of the polygon. This combining approach maintains comprehensive measurement coverage while eliminating redundant inspections, thereby improving inspection reliability without proportionally increasing inspection time.
Solution Approach 2:
The patent segments the measurement process into distinct stages: first generating non-overlapping first measurement regions, then providing overlapping preliminary measurement regions on measurement points, grouping overlapping regions into polygons, and finally selecting representative second measurement regions. This segmentation allows systematic management of measurement coverage and redundancy, optimizing the balance between reliability and time efficiency.
2Reliability
If comprehensive measurement coverage is provided through overlapping measurement regions, then defect detection reliability is improved, but the complexity of measurement map generation increases
Solution Approach 1:
The patent performs preliminary actions by first providing a pattern layout with measurement points, then generating first measurement regions that overlap measurement points without overlapping each other. Subsequently, preliminary measurement regions are provided on measurement points, and overlapping regions are grouped into polygons before selecting final measurement regions. This preliminary structuring simplifies the overall measurement map generation process while ensuring comprehensive coverage.
Solution Approach 2:
The patent transitions from a two-dimensional plan view of overlapping measurement regions to a simplified representation by grouping overlapping regions into polygons and selecting representative regions at polygon centers. This dimensional transformation reduces complexity by converting a complex overlapping two-dimensional arrangement into a simplified set of non-overlapping representative regions while preserving measurement coverage.
Data Source
AI summary
Provided is an inspection method including providing a pattern layout including measurement points, generating a first measurement map including first measurement regions that overlap the measurement points and do not overlap each other in a two-dimensional plan view, providing preliminary measurement regions on the measurement points, producing a polygon by grouping ones of the preliminary measurement regions that overlap each other in the two-dimensional plan view, providing a second measurement region on a center of the polygon, selecting the second measurement region when all of the measurement points in the polygon overlap the second measurement region in the two-dimensional plan view, generating a second measurement map including the selected second measurement region, generating a third measurement map by using the first and second measurement maps, and inspecting patterns on a semiconductor substrate by using the third measurement map. The third measurement map includes the selected second measurement region and ones of the first measurement regions that do not overlap the selected second measurement region in the two-dimensional plan view.