Inspection Contact Pin Structure With Thermal Bypass Casing
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Solution Overview
Problem
Probe type contact pins used in IC packages face challenges in improving electrical and thermal performance due to their complex structure, which affects heat dissipation and conductivity.
Innovation Solution
A contact pin design featuring laterally stacked electrical and thermal contacts bundled by an electrically conductive casing that bypasses the elastic deformation part, with overlapping casings and protrusions to enhance conductivity and handleability, and a stopper to prevent excessive compression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a probe type contact pin is formed of three or more components including a plunger, a barrel, and a coil spring, then the contact pin can provide elastic contact and compression resistance, but the electrical performance and thermal performance deteriorate due to the complex internal contact system
Solution Approach 1:
The contact pin is divided into multiple independent contacts (first contact, second contact, third contact) that are laterally stacked and can move independently. Each contact has its own elastic deformation part, allowing them to adapt to variations in IC package height and provide stable contact without requiring a complex internal contact system like the conventional plunger-barrel-coil spring structure.
Solution Approach 2:
The invention transitions from a vertical stacking arrangement (conventional plunger-barrel-coil spring) to a lateral stacking arrangement where multiple contacts are positioned side-by-side. This dimensional change allows for simplified internal contact systems while maintaining contact stability through independent elastic deformation of each contact in the vertical direction.
2Adaptability or versatility
If the elastic deformation part is made elastically expandable and compressible, then the contact pin can adapt to IC package variations, but the electrical and thermal performance deteriorate due to the complex structure of the elastic deformation part
Solution Approach 1:
The elastic deformation function is segmented into separate elastic deformation parts for each contact (first elastic deformation part, second elastic deformation part, third elastic deformation part). Each elastic deformation part is simple in structure and can independently adapt to variations in IC package height, eliminating the need for a complex unified elastic structure.
Solution Approach 2:
Each contact is designed with its own elastic deformation part having specific local properties optimized for that contact's function. The first contact has a first elastic deformation part, the second contact has a second elastic deformation part, and the third contact has a third elastic deformation part, allowing each to independently adapt to local variations in the IC package while maintaining simple individual structures.
3Device complexity
If multiple contacts are laterally stacked to improve electrical and thermal performance, then the contact area increases, but the handleability of the contacts deteriorates without a bundling structure
Solution Approach 1:
Multiple independent contacts (first contact, second contact, third contact) that are laterally stacked are merged into a single integrated contact pin assembly. This bundling structure allows the contacts to be handled as one unit while maintaining their individual elastic deformation capabilities and increased total contact area with the IC package.
Solution Approach 2:
The contact pin assembly serves multiple functions: it provides mechanical support through the bundled structure, electrical contact through the conductive contacts, thermal dissipation through the laterally stacked contact arrangement, and adaptation to IC package variations through the independent elastic deformation parts of each contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves electrical and thermal performance by increasing contact area and stability, while preventing damage from excessive compression, and allows for combined electrical and thermal contact functions.
Implementation Method 1
each of the contacts extending from a base end to a tip and having an elastic deformation part formed between the base end and the tip, and the elastic deformation part being elastically expandable and compressible in an extending direction
Implementation Method 2
the casing is in contact with the contacts so as to form a path bypassing the elastic deformation part... transfer electricity... while bypassing the elastic deformation part
Implementation Method 3
transfer electricity or heat from the base end to the portion on the tip side of the contacts while bypassing the elastic deformation part
Data Source
AI summary
Provided are a contact pin and a socket for inspection that can improve electrical performance or thermal performance. An embodiment includes: an electric conductive electrical contact extending from the base end to the tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; an electric conductive thermal contact extending from the base end to the tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; and an electrically conductive casing that bundles the electrical contact and the thermal contact laterally stacked adjacent to each other, and the casing is in contact with the electrical contact and the thermal contact so as to form a path bypassing the elastic deformation part.