Inspection Socket Using Air Pressure and Intermediary for Semiconductor Testing
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Solution Overview
Problem
Conventional inspection sockets risk damaging semiconductor integrated circuits with protective covers by directly pushing them, leading to foreign matter adherence and decreased sensitivity of input optical signals.
Innovation Solution
An inspection socket design that uses a rod-shaped contact probe and air pressure to elastically contact the object's electrode with the inspection electrode, pushing the object toward the inspection substrate without direct contact, utilizing airtight spaces and seal members to prevent foreign matter adherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pushing body directly pushes the protective cover of the semiconductor integrated circuit, then the object to be inspected can be pushed toward the inspection substrate side for electrical contact, but foreign matters or contact marks may adhere to the protective cover, decreasing the sensitivity of input optical signals
Solution Approach 1:
The patent introduces a positioning portion as an intermediary component between the pushing body and the semiconductor integrated circuit. The pushing body pushes the positioning portion, which in turn pushes the semiconductor integrated circuit on its upper surface. This mediator prevents direct contact between the pushing body and the protective cover, eliminating foreign matter adherence and contact marks while maintaining reliable electrical contact through the contact probe.
2Ease of operation
If a conventional inspection socket is used to inspect semiconductor integrated circuits with protective covers, then the structure is simple and easy to operate, but the protective cover is directly pushed leading to foreign matter adherence and decreased optical signal sensitivity
Solution Approach 1:
The patent segments the pushing function into two distinct components: the positioning portion that contacts the semiconductor integrated circuit and the pushing body that applies force. This segmentation allows the system to maintain ease of operation through automated pushing while preventing harmful direct contact between the pushing body and the protective cover, thus eliminating foreign matter adherence.
3Reliability
If the contact probe is compressed by a coil spring to achieve elastic contact, then electrical contact is established, but the pushing force may directly affect the protective cover causing contamination
Solution Approach 1:
The positioning portion serves as a mediator that decouples the pushing force application from the electrical contact process. The coil spring compresses to provide elastic contact force, but this force is transmitted through the positioning portion rather than directly to the protective cover. This intermediary structure maintains stable electrical contact while preventing contact marks and contamination on the protective cover.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the inspection of semiconductor integrated circuits with protective covers without adhering foreign matters or contact marks, ensuring accurate electrical characteristic measurement.
Implementation Method 1
a holding unit, which is different from the pushing unit, that integrally holds the object to be inspected and the positioning portion by pushing the object to be inspected against the placement portion of the positioning portion by air pressure
Implementation Method 2
the contact probe, placed between the object to be inspected and the inspection substrate, is elastically contacted with the electrode on the side of the object to be tested and the electrode on the side of the inspection substrate, by compressing the coil spring provided in the contact probe
Data Source
AI summary
Provided is an inspection socket capable of elastically contacting the conductor with the electrode of the object to be tested and the electrode for inspection by pushing the object to be inspected toward the inspection substrate side, without adhering foreign matters or contact marks to the object to be inspected.The inspection socket is so configured that the object to be inspected (100) is pushed toward the inspection substrate (10) without touching the object to be inspected (100), by integrally holding the object to be inspected (100) and the positioning table (20) using air pressure (negative pressure or positive pressure) and pushing the positioning table (20) by the pushing unit (50), so that the object to be inspected comes into contact with the land (11) of the inspection substrate (10) through the contact probe (30).