Inspection Socket Heat Dissipator for High Current Thermal Management
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Solution Overview
Problem
Existing inspection sockets for semiconductor integrated circuits face challenges in allowing large currents to flow during energization inspections, leading to elevated temperatures and reduced elastic operating performance of the contact probe.
Innovation Solution
The inspection socket incorporates a heat dissipator with electrical insulating properties, located between the contact probe and the pin block, to effectively transmit heat away from the contact probe and prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a large current is allowed to flow through the contact probe during energization inspection, then the inspection capability is improved, but the temperature of the contact probe increases and elastic operating performance deteriorates
Solution Approach 1:
A heat dissipator made of electrically insulating material is introduced as an intermediary component between the contact probe and the pin block. This heat dissipator has high thermal conductivity to conduct heat away from the contact probe, while maintaining electrical insulation to prevent short circuits. The heat dissipator thus mediates between the need for high current carrying capacity and the need to control temperature, allowing large currents to flow without excessive temperature rise.
2Temperature
If a heat dissipator with electrical insulating properties is introduced between the contact probe and pin block, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat dissipator is designed to perform multiple functions simultaneously: it serves as a thermal conductor to dissipate heat from the contact probe, while also providing electrical insulation between the conductive contact probe and the pin block. This multi-functionality reduces the need for additional separate components, thereby minimizing the increase in device complexity while achieving effective temperature control.
3Device complexity
If the contact probe is directly connected to the pin block, then device complexity is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipator acts as an intermediary component that improves heat dissipation efficiency without significantly increasing device complexity. By positioning the heat dissipator between the contact probe and pin block, heat is conducted away from the contact probe more effectively, preventing energy loss through excessive heating, while the overall structural complexity remains manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for the safe passage of larger currents without compromising the contact probe's performance, maintaining its elastic operation and extending its operational temperature limits.
Implementation Method 1
a heat dissipator located on an internal side in the through hole in a through direction of the through hole between the pin block and the contact probe and having an electrical insulating property for transmitting heat from the contact probe to the pin block
Data Source
AI summary
An inspection socket including: a contact probe; a pin block having a through hole for accommodating the contact probe; and a heat dissipator located on an internal side in the through hole in a through direction of the through hole between the pin block and the contact probe and having an electrical insulating property for transmitting heat from the contact probe to the pin block.