Semiconductor Inspection Stage With Local Temperature Control

Solution Overview

Problem

Existing semiconductor device inspection methods struggle with non-uniform temperature distribution due to local heat generation, leading to inaccurate inspections of semiconductor devices.

Innovation Solution

Incorporation of a temperature adjustment unit with multiple small temperature adjustment elements in the inspection apparatus, allowing precise temperature control and heat management at the local level, using Peltier elements or similar devices to counteract self-heating and maintain uniform temperature during inspections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a conventional inspection apparatus without localized temperature control is used, then the device complexity is low, but the inspection accuracy deteriorates due to non-uniform temperature distribution

Engineering Contradiction:

Improveinspection accuracyVSAvoiddevice complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The temperature adjustment unit is divided into multiple temperature adjustment elements arranged in a matrix pattern on the stage surface. Each element can independently adjust the temperature at its local position, enabling segmented and precise temperature control across different regions of the semiconductor device under inspection.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each temperature adjustment element is designed to control the temperature at its specific local position on the stage. This allows different regions of the stage to have different temperature characteristics, matching the local heat generation patterns of the semiconductor device and achieving uniform temperature distribution across the entire device.

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If multiple temperature adjustment elements are added to the stage, then the temperature control precision is improved, but the manufacturing cost and device complexity increase

Engineering Contradiction:

Improvetemperature control precisionVSAvoidease of manufacture

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The temperature adjustment unit is divided into multiple temperature adjustment elements arranged in a matrix pattern on the stage surface. Each element can independently adjust the temperature at its local position, enabling segmented and precise temperature control across different regions of the semiconductor device under inspection.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system changes the temperature parameter locally at different positions on the stage by controlling each temperature adjustment element independently. This allows precise temperature control to be achieved by adjusting the operating parameters of multiple simple elements rather than using a single complex temperature control system.

Inventive Principle:

Principle #35Parameter changes

3Stability of the object's composition

If the temperature adjustment elements are made small to match device size, then the temperature uniformity is improved, but the number of elements required increases

Engineering Contradiction:

Improvetemperature uniformityVSAvoidnumber of elements

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The temperature adjustment unit is divided into multiple temperature adjustment elements arranged in a matrix pattern on the stage surface. Each element can independently adjust the temperature at its local position, enabling segmented and precise temperature control across different regions of the semiconductor device under inspection.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The temperature adjustment elements are arranged in a two-dimensional matrix pattern on the stage surface, extending the temperature control capability from a single point or line to a distributed two-dimensional array. This dimensional expansion allows comprehensive temperature uniformity across the entire stage surface while keeping each individual element small and simple.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances inspection accuracy by effectively managing local temperature fluctuations, ensuring precise and uniform temperature control across semiconductor devices, thereby improving the overall inspection quality.

Implementation Method 1

the temperature adjustment unit includes a plurality of temperature adjustment elements, each of which controls a temperature at a position corresponding to each of the plurality of temperature adjustment elements

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

using Peltier elements or similar devices to counteract self-heating and maintain uniform temperature during inspections

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS20260063707A1Inspection method of a semiconductor device and the inspection program of the semiconductor device

Publication Date: 2026.03.05 RENESAS ELECTRONICS CORP

AI summary

An inspection method of a semiconductor device includes inspecting the semiconductor device that is included in a sample placed on a stage of an inspection apparatus. The stage includes a temperature adjustment unit. The temperature adjustment unit includes a plurality of temperature adjustment elements. The plurality of temperature adjustment elements are arranged in a plane parallel to a stage surface of the stage where the sample is placed, and a size of each of the plurality of temperature adjustment elements is smaller than or equal to a size of the semiconductor device in a plain view.