Electron Beam Inspection Stage Mounting for Vibration and Thermal Decoupling
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Solution Overview
Problem
Semiconductor processes face positional errors due to dynamic and thermal vibrations, impacting device yield and accuracy in electron beam inspection apparatuses, particularly in SEMs, where existing stage positioning systems fail to effectively mitigate these errors.
Innovation Solution
A stage apparatus with a combination of damped connections and a stiff center connection is used to connect the object support to the positioning device, which dampens vibrations and decouples thermal deformations, ensuring precise positioning with reduced error.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a rigid connection is used to connect the object support to the positioning device, then positioning stability is improved, but thermal deformation is transmitted and measurement precision deteriorates
Solution Approach 1:
The connection arrangement is segmented into multiple independent connections (first connection, second connection, third connection) between the object support and positioning device. This segmentation allows each connection to handle specific functions (rigid support vs. damped isolation) independently, resolving the contradiction between stability and precision by distributing different connection characteristics across multiple elements.
Solution Approach 2:
Different connections are assigned different local qualities: some connections are designed to be rigid (providing stable positioning), while others incorporate damping elements (providing thermal isolation). This local differentiation allows the system to simultaneously achieve both positioning stability and thermal deformation isolation, resolving the contradiction between stability and precision.
2Stability of the object's composition
If a damped connection is used to connect the object support to the positioning device, then vibration is reduced, but positioning rigidity deteriorates
Solution Approach 1:
The connection system is divided into multiple independent connections with different characteristics. Some connections use damping elements to reduce vibration, while others maintain rigid connections for positional stability. This segmentation allows the system to achieve both vibration reduction and sufficient rigidity simultaneously.
Solution Approach 2:
The connection arrangement uses composite construction combining rigid structural elements with damped isolation elements. This composite approach allows the system to exhibit both rigid behavior (for stability) and damped behavior (for vibration reduction) depending on the specific connection path, resolving the contradiction between rigidity and vibration reduction.
3Measurement precision
If thermal isolation is implemented between object support and positioning device, then thermal deformation is reduced, but mechanical stability deteriorates
Solution Approach 1:
The support structure is segmented into thermally isolated segments connected by damped connections. This segmentation allows thermal deformation to be isolated in specific regions while maintaining mechanical stability through the distributed connection arrangement, resolving the contradiction between thermal isolation and mechanical stability.
Solution Approach 2:
Damped connections act as intermediary elements between the object support and positioning device. These intermediaries provide both mechanical support (maintaining stability) and thermal isolation (reducing thermal error), simultaneously addressing both requirements without direct rigid thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces thermal and dynamic errors, achieving sub-nanometer positioning accuracy and improving the robustness and control simplicity of the stage apparatus, thereby enhancing the precision of electron beam inspection and metrology.
Implementation Method 1
a first connection arrangement configured to connect the object support to the positioning device, the first connection arrangement comprising at least one damped connection
Implementation Method 2
which dampens vibrations and decouples thermal deformations
Data Source
AI summary
Disclosed is a stage apparatus comprising: an object support configured to support an object; a positioning device configured to position the object support; a first connection arrangement configured to connect the object support to the positioning device, the first connection arrangement comprising at least one damped connection; and a second connection arrangement configured to connect the object support to the positioning device, the second connection arrangement comprising at least one substantially rigid connection.