Inspection Substrate for Color-Independent Die Collet Contamination
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Solution Overview
Problem
In semiconductor device assembly, foreign materials adhering to die collets can damage semiconductor chips, and existing monitoring methods, such as camera-based detection, struggle with materials of varying colors, making it difficult to reliably detect and prevent foreign material adhesion.
Innovation Solution
The use of a substrate for foreign material adhesion inspection, which includes a conductor layer and an insulating layer thinner than the foreign material to be detected, allows for the measurement of physical quantities between these layers when a die collet comes into contact, enabling the determination of foreign material adhesion regardless of color.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If camera-based detection is used to monitor foreign materials on die collet, then detection can be performed, but detection becomes difficult when foreign material color varies
Solution Approach 1:
The patent replaces the optical detection system (camera) with an electrical detection system. A substrate includes a conductor layer, insulating layer, and upper conductor layer that forms an electrical circuit. When a die collet contacts the substrate, foreign materials are detected through changes in electrical physical quantities (resistance, capacitance, or inductance) rather than optical properties, making detection independent of foreign material color.
2Measurement precision
If a thin insulating layer is used to enable detection of small foreign materials, then detection sensitivity increases, but the substrate becomes more vulnerable to damage
Solution Approach 1:
The substrate employs a composite structure combining conductor layers and insulating layers with different functional properties. The insulating layer provides both the necessary thinness for detecting small foreign materials (enabling electrical contact when foreign material is present) and sufficient mechanical strength to prevent substrate damage. The conductor layers provide electrical pathways for detection while the insulating layer provides structural support and electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively relaxes the constraint of foreign material color, allowing for reliable detection of adhesion, thereby preventing damage to semiconductor chips and improving the accuracy of foreign material inspection.
Implementation Method 1
measuring a physical quantity between the first conductor layer and the second conductor layer
Implementation Method 2
measuring a physical quantity between the first conductor layer and the second conductor layer
Data Source
AI summary
A substrate for foreign material adhesion inspection according to the disclosure includes a first conductor layer; and an insulating layer provided on the first conductor layer, the insulating layer being thinner than a foreign material to be detected.