Inspection System Automatic Parameter Adjustment
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Solution Overview
Problem
In semiconductor device manufacturing, existing inspection systems face challenges in accurately aligning probes with devices on wafers, leading to inefficiencies and potential damage due to irregular index data outside predetermined ranges, which requires frequent manual adjustments by administrators.
Innovation Solution
An inspection system comprising a data processing apparatus that collects and analyzes apparatus parameters and index data from multiple inspection apparatuses, using a model to calculate adjustment amounts for apparatus parameters when index data falls outside allowable ranges, thereby automating the adjustment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual adjustment of apparatus parameters is performed by administrators, then alignment accuracy can be improved, but maintenance time and system downtime increase
Solution Approach 1:
The inspection apparatus automatically monitors its own index data and performs self-diagnosis to determine when parameters need adjustment. The system calculates adjustment amounts automatically and executes parameter changes without administrator intervention, enabling the device to service itself and eliminate manual maintenance time.
Solution Approach 2:
The system continuously monitors index data from inspection results and feeds this information back to automatically adjust apparatus parameters. When index data falls outside predetermined ranges, the system calculates the necessary adjustment amount and implements parameter changes, creating a closed-loop feedback mechanism that maintains alignment accuracy without manual intervention.
2Measurement precision
If frequent manual adjustments are performed to maintain alignment accuracy, then measurement precision is improved, but productivity decreases due to maintenance interruptions
Solution Approach 1:
The automatic parameter adjustment system enables the inspection apparatus to maintain its own alignment accuracy without requiring maintenance personnel. By autonomously detecting when adjustments are needed and executing parameter changes during or between inspections, the system eliminates productivity losses from manual maintenance interruptions while preserving measurement precision.
Solution Approach 2:
The system enables continuous inspection operations by automatically handling parameter adjustments without stopping the inspection process. The apparatus maintains alignment accuracy throughout continuous operation by real-time monitoring and automatic adjustment, eliminating interruptions that would otherwise break the continuity of useful inspection actions.
3Manufacturing precision
If complex alignment correction methods are implemented, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
Rather than implementing complex mechanical alignment correction mechanisms, the system uses software-based automatic parameter adjustment. The apparatus self-monitors alignment quality through index data and automatically corrects parameters through calculation and control software, replacing complex physical correction mechanisms with simpler automated control logic.
Solution Approach 2:
The system replaces complex mechanical alignment correction systems with software-based parameter adjustment. Instead of using complex mechanical mechanisms to physically realign components, the system uses computational algorithms to calculate adjustment amounts and modifies control parameters electronically, substituting mechanical complexity with software-based solutions.
Data Source
AI summary
An inspection system includes a plurality of inspection apparatuses, and a data processing apparatus capable of communicating with the plurality of inspection apparatuses. The data processing apparatus includes a storage part storing a model that determines a causal relationship between an apparatus parameter related to setting of the plurality of inspection apparatuses and index data obtained when the plurality of inspection apparatuses are operated, a collection part collecting the apparatus parameter and the index data, a determination part determining whether or not the index data is included in a predetermined allowable range, and a calculation part calculating an adjustment amount for adjusting the apparatus parameter, based on the apparatus parameter and the index data, and the model, when it is determined that the index data is not included in the predetermined allowable range.