Inspection Tool Metrology Transfer Across Different Wafer Features
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Solution Overview
Problem
Existing semiconductor manufacturing systems face limitations in high-throughput metrology and inspection, particularly in measuring parameters like coated film thickness and process uniformity across wafers, which are time-consuming and computationally expensive.
Innovation Solution
A system and method for determining metrology-like information using an inspection tool that includes output acquisition subsystems to generate data from a specimen, with computer subsystems analyzing first and second process information from mutually exclusive areas on the specimen, enabling efficient measurement of different feature designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a separate metrology tool is used to obtain reference measurements, then measurement precision is improved, but device complexity and productivity are worsened due to multiple tools and alignment requirements
Solution Approach 1:
The patent combines the inspection tool and metrology tool into a single integrated system. The inspection tool is configured to perform both inspection measurements and metrology measurements on the same specimen, eliminating the need for separate tools and reducing system complexity while maintaining measurement precision
Solution Approach 2:
The inspection tool is designed with multi-functionality to perform both inspection measurements and metrology measurements. The same measurement system can switch between different measurement modes, reducing the need for multiple specialized tools and simplifying the overall system architecture
2Measurement precision
If a separate metrology tool is used to obtain reference measurements, then measurement precision is improved, but productivity is worsened due to time-consuming alignment and coordination between tools
Solution Approach 1:
By merging the inspection and metrology functions into a single tool, the patent eliminates the time required for alignment and coordination between separate tools. The integrated system can perform both types of measurements in sequence or simultaneously, significantly improving measurement throughput and productivity
3Measurement precision
If different measurement systems are used for inspection and metrology, then measurement precision is improved, but ease of operation is worsened due to complex coordination and alignment
Solution Approach 1:
The patent integrates inspection and metrology measurements into a single measurement system, eliminating the need for complex coordination and alignment operations. The unified system uses the same measurement infrastructure for both functions, greatly simplifying operation while maintaining the precision benefits of metrology-level measurements
Data Source
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AI summary
Methods and systems for determining metrology-like information for a specimen using an inspection tool are provided. One method includes determining first process information for first feature(s) formed in first area(s) on a specimen from output generated by output acquisition subsystem(s) that include an inspection subsystem. The method also includes determining second process information for second feature(s) formed in second area(s) on the specimen from the output and at least a portion of the first process information. At least a portion of the second process information is a different type of information than the first process information. At least a portion of a design for the second feature(s) is different than a design for the first feature(s), and the first area(s) and the second area(s) are mutually exclusive on the specimen.