Inspection Unit Segmentation for Analogue Digital Ground Isolation
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Solution Overview
Problem
Existing inspection units for high-frequency/high-speed devices cannot accurately separate analogue and digital ground terminals, leading to noise interference during electrical performance inspection, as they rely on a monolithic metal block structure that connects all grounding contact probes electrically.
Innovation Solution
An inspection unit with an insulative block and conductive plating layer, divided into regions by grooves to isolate contact probes for analogue and digital circuits, allowing independent grounding and maintaining impedance matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a monolithic metal block structure is used to hold contact probes, then mechanical strength and ease of manufacture are improved, but the ability to separate analogue and digital ground terminals is worsened, causing noise interference
Solution Approach 1:
The metal block is divided into multiple regions by grooves that extend from the first face to the second face, separating the ground contact probes into distinct analogue ground region and digital ground region. This segmentation prevents electrical connection between different ground types, eliminating noise interference while maintaining the structural advantages of a monolithic block.
2Ease of manufacture
If all ground contact probes are connected through a metal block, then manufacturing simplicity is improved, but measurement precision is worsened due to inability to separate ground potentials
Solution Approach 1:
The metal block is segmented into multiple electrically isolated regions by grooves, allowing separate grounding for analogue and digital circuits. This enables accurate measurement of high-frequency signals by preventing digital noise from contaminating analogue measurements, while still using a single integrated metal block structure for manufacturing simplicity.
Data Source
AI summary
An insulative block has a first face adapted to oppose a board on which an inspection circuit is arranged and a second face adapted to oppose a device to be inspected. The insulative block is formed with through holes each of which communicates the first face and the second face. A conductive plating layer is formed on the first face, the second face, and an inner face of at least one of the through holes. Each of contact probes includes a conductive tubular body held in an associated one of the through holes and a plunger which is retractably projected from one end of the tubular body and is adapted to come in contact with a terminal of the device. The contact probes includes a first group of contact probes adapted to come in contact with terminals of a first circuit in the device, and a second group of contact probes adapted to come in contact with terminals of a second circuit in the device. The plating layer is divided by a groove into a first region including the first group of the contact probes and a second region including the second group of the contact probes, so that the first region and the second region are electrically insulated from one another.