Instrumented Substrate Alignment for Chuck and Focus Ring Offsets
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current substrate monitoring systems face challenges in accurately determining the precise positioning of substrates relative to processing tools, particularly in high-resolution micro- or nano-scale inspections, due to limitations in measuring substrate-to-chuck and substrate-to-ring offsets, which can lead to errors in defect detection and data collection.
Innovation Solution
An instrumented substrate with integrated position units, including an illumination source and line sensors, and a controller that generates line images to determine substrate-to-chuck and substrate-to-ring offsets, allowing for precise positioning and repositioning of the substrate to minimize errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional substrate monitoring systems are used, then the system structure is simple, but the measurement precision of substrate-to-chuck and substrate-to-ring offsets is insufficient
Solution Approach 1:
The patent merges the illumination source, line sensors, and controller directly into the substrate structure, creating an integrated substrate monitoring system. This combination allows precise offset measurements to be performed at the substrate level itself, eliminating the need for separate external monitoring equipment and achieving high measurement precision while managing system complexity through integration.
Solution Approach 2:
The patent introduces line sensors as intermediary detection elements that capture optical images of the substrate edges and chuck surface. These line sensors act as mediators between the illumination source and the controller, enabling precise measurement of substrate-to-chuck and substrate-to-ring offsets through optical image analysis without requiring direct physical contact or complex mechanical measurement systems.
2Manufacturing precision
If conventional substrate monitoring systems are used, then the device complexity is low, but the positioning precision for high-resolution inspection is insufficient
Solution Approach 1:
By integrating the monitoring functions directly into the substrate structure with embedded illumination sources and line sensors, the system achieves precise positioning measurements without requiring complex external positioning equipment. The merged design enables the substrate to self-monitor its position relative to the chuck and focus ring, improving manufacturing precision while keeping the overall system manageable.
Solution Approach 2:
The patent replaces mechanical positioning measurement methods with optical-based line sensor imaging. Instead of using mechanical gauges or contact-based measurement systems, the invention uses optical illumination and line sensor capture to determine substrate position, achieving higher precision for high-resolution inspections while reducing mechanical complexity.
3Reliability
If substrate position monitoring is not performed, then the system is simpler, but errors in defect detection and data collection increase
Solution Approach 1:
The integration of illumination sources, line sensors, and a controller directly into the substrate creates a self-monitoring system that reliably tracks substrate position during inspection. This merged design ensures accurate defect detection by continuously monitoring position offsets without requiring separate, complex external verification systems, thereby improving reliability while managing complexity through consolidation.
Solution Approach 2:
The substrate monitoring system performs self-service by using its own integrated components (illumination source and line sensors) to monitor its position relative to the chuck and focus ring. This self-monitoring capability ensures accurate defect detection and data collection without requiring external intervention or additional complex verification equipment, improving reliability through autonomous position tracking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate and efficient determination of substrate offsets, improving the precision of substrate positioning, reducing errors in defect detection, and enhancing the quality of data collection in high-resolution inspections.
Implementation Method 1
an illumination source configured to generate illumination
Implementation Method 2
a line sensor configured to generate a plurality of line images based on the illumination
Data Source
AI summary
An instrumented substrate is used in a substrate processing system to determine offsets to a chuck and a focus ring. The instrumented substrate includes line sensors which generate line images and a controller which determines the offsets based on the line images. A substrate handler then repositions the instrumented substrate to reduce the offsets.