Instrumented Wafer Channels for In-Situ Process Condition Sensing
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Solution Overview
Problem
Current methods for characterizing conditions experienced by semiconductor substrates during processing are inadequate, as they fail to accurately measure dynamic changes and risk points, leading to issues like low yields and contamination, especially when wafers are moved through aggressively changing environments.
Innovation Solution
An instrumented substrate equipped with sensors such as air pressure, air velocity, and acceleration sensors, which are embedded within the substrate and connected to channels that allow fluidic communication with the external environment, enabling the measurement of conditions experienced by the substrate during processing, and transmitting this data to a controller for adjusting process conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensors are placed within a chamber to measure conditions, then environmental conditions can be monitored, but the measurements do not fully capture the conditions that a wafer experiences
Solution Approach 1:
The patent creates a copy of the wafer (instrumented substrate) that replicates its physical characteristics and experiences the same processing environment. This copy includes embedded sensors that directly measure the conditions the substrate experiences, providing accurate condition characterization while the actual production wafers continue normal processing without modification
2Measurement precision
If an instrumented substrate with embedded sensors and channels is used, then accurate condition measurement is achieved, but the substrate structure becomes more complex
Solution Approach 1:
The patent embeds sensors and channels within the substrate structure itself, nesting the measurement system inside the substrate. The sensors are positioned within cavities or channels that are integrated into the substrate body, allowing direct measurement of conditions at the substrate surface while maintaining a compact, unified structure
3Reliability
If production processes are simulated without adding layers, then yield improvement and contamination reduction are achieved, but process completeness is reduced
Solution Approach 1:
The patent extracts the measurement and optimization function from the full production process. By using an instrumented substrate that simulates processing conditions without completing the full multi-step production sequence (no deposition, etching, or layer addition), the system isolates the environmental characterization aspect to optimize process parameters before actual production runs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides more accurate characterization of substrate conditions, improving yield and reducing contamination by simulating production processes without adding layers, allowing for better optimization and risk assessment during semiconductor processing.
Implementation Method 1
one or more sensors coupled to the substrate body and configured to measure one or more conditions of at least one of the substrate body or of an external environment proximate to a surface of the substrate body
Implementation Method 2
the second sensor may include at least one of an air velocity sensor or an air pressure sensor
Implementation Method 3
the second sensor may include at least one of an air velocity sensor or an air pressure sensor
Implementation Method 4
each channel of the first set of channels may include an open channel configured to allow a flow of gas through the open channel
Data Source
AI summary
A system and method for measuring substrate processing conditions are disclosed. The system may include an instrumented substrate including a substrate body. The instrumented substrate may include one or more sensors configured to measure one or more conditions of the at least one of the substrate body or of an external environment proximate to a surface of the substrate body. The substrate body may include channels within the substrate body connected to the one or more sensors. Each channel may include an open channel configured to allow a flow of gas through the open channel.