Thermally Conductive Encapsulation Resin for Insulated Bridge Packaging
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Solution Overview
Problem
Semiconductor devices face challenges in ensuring both electric insulation and effective heat dissipation without the need for additional components like insulating heat dissipating gels, particularly in designs where the heat sinks are exposed and require separate insulation measures.
Innovation Solution
A semiconductor device configuration that includes a semiconductor element, a lead frame, and a sealing resin with electric insulation and thermal conductivity of 2.2 W or more, which covers the components without exposing the bridge member, ensuring both electric insulation and enhanced heat dissipation by integrating thermal conductivity into the resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are exposed from the sealing resin to enable heat dissipation, then heat dissipation performance is improved, but electric insulation becomes problematic requiring additional insulating components
Solution Approach 1:
The patent merges the heat dissipation function and electric insulation function into a single integrated sealing resin component. The resin simultaneously provides thermal conduction pathways through filler materials while maintaining electrical insulation properties, eliminating the need for separate insulating components on exposed heat sinks.
Solution Approach 2:
The sealing resin is formulated as a composite material containing conductive filler particles (such as metal oxides or ceramic materials) embedded in an electrically insulating resin matrix. This composite structure enables the material to conduct heat effectively through the filler network while the resin matrix maintains electrical insulation, resolving the contradiction between heat dissipation and electric insulation.
2Reliability
If additional insulating components like insulating gels are added to ensure electric insulation, then electric insulation is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The sealing resin is designed to perform multiple functions simultaneously: structural sealing, heat dissipation, and electric insulation. By making the sealing resin universal in its functionality, the patent eliminates the need for additional specialized insulating components, thereby reducing device complexity and manufacturing steps.
Solution Approach 2:
The patent combines the functions of the sealing resin and insulating components into a single integrated material system. The sealing resin incorporates insulating properties directly, merging what were previously separate functional elements into one component, thus simplifying the overall device structure.
3Temperature
If the sealing resin has high thermal conductivity for heat dissipation, then heat dissipation performance is improved, but electric insulation may be compromised
Solution Approach 1:
The sealing resin is formulated as a composite material containing conductive filler particles (such as metal oxides or ceramic materials) embedded in an electrically insulating resin matrix. This composite structure enables the material to conduct heat effectively through the filler network while the resin matrix maintains electrical insulation, resolving the contradiction between heat dissipation and electric insulation.
Solution Approach 2:
The patent applies local quality by creating different thermal and electrical properties at different scales within the material. At the micro-scale, conductive filler particles provide thermal conduction pathways, while at the macro-scale, the insulating resin matrix maintains overall electrical insulation. This local differentiation of properties allows simultaneous optimization of both heat dissipation and electric insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration ensures secure electric insulation and improved heat dissipation without the need for additional insulating components, achieving thermal resistance comparable to or better than devices using insulating gels, while maintaining the integrity of the semiconductor device's structure.
Implementation Method 1
the sealing resin has electric insulation, has a thermal conductivity of 2.2 W or more, and covers the semiconductor element, the lead frame, and the bridge member
Data Source
AI summary
A semiconductor device includes a semiconductor element, a lead frame, a bridge member, and a sealing resin. The semiconductor element has first and second surfaces opposite from each other, and has first and second electrodes respectively exposed on the first and second surfaces. The lead frame includes a mounting portion and a non-mounting portion divided from the mounting portion. The mounting portion has a mounting surface to which the semiconductor element is mounted and the first electrode is electrically connected, and an opposite surface opposite from the mounting surface. The bridge member electrically connects the second electrode and the non-mounting portion. The sealing resin has electric insulation, has a thermal conductivity of 2.2 W or more, and covers the semiconductor element, the lead frame, and the bridge member in a state where the opposite surface of the mounting portion is exposed from the sealing resin.