Insulated Heat-Dissipating Circuit Assembly With Lower Thermal Resistance
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Solution Overview
Problem
Conventional circuit assemblies with heat-generating components suffer from high thermal resistance due to multiple components in the heat-dissipating path, which hampers effective heat dissipation, particularly in large-current devices.
Innovation Solution
A circuit assembly design featuring a metal plate with a heat-dissipating portion exposed outside the case, covered by an insulating film and connected via a thermal conductive filling member to a heat-dissipation target, reducing the number of components in the heat-dissipating path and ensuring insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple components are used in the heat-dissipating path (insulating thermal conductive sheet, heat sink, bus bar, case), then insulation between heat-dissipating portion and heat-dissipation target is ensured, but thermal resistance increases and heat dissipation effectiveness deteriorates
Solution Approach 1:
The insulating film and thermal conductive filling member are merged into a integrated heat-dissipation structure that combines insulation and thermal conduction functions. The metal plate with exposed heat-dissipating portion directly contacts the heat-dissipation target through the filling member, eliminating the need for separate heat sink and bus bar components, thus reducing thermal resistance while maintaining insulation.
Solution Approach 2:
The heat-dissipating portion of the metal plate is extracted and exposed to the outside of the case, allowing direct thermal contact with the heat-dissipation target. This extraction eliminates unnecessary intermediate components in the heat-dissipating path, reducing thermal resistance while the insulating film maintains electrical insulation.
2Temperature
If the heat-dissipating portion is directly exposed outside the case for direct thermal contact, then thermal resistance is reduced and heat dissipation is improved, but insulation between heat-dissipating portion and heat-dissipation target may be compromised
Solution Approach 1:
The thermal conductive filling member acts as an intermediary between the heat-dissipating portion and the heat-dissipation target. It provides thermal conduction while the insulating film covering the contact surface maintains electrical insulation. This intermediary approach allows direct thermal contact while preserving insulation through the film barrier.
Solution Approach 2:
The insulating film is applied locally only to the contact surface of the heat-dissipating portion that interfaces with the heat-dissipation target. This localized insulation approach maintains electrical isolation where needed while allowing thermal conduction through the filling member, optimizing both insulation and heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces thermal resistance and improves heat dissipation while maintaining insulation, even in the presence of tolerances or gaps, by using separate insulating and thermal conductive members.
Implementation Method 1
a thermal conductive filling member that is in thermal contact with the heat-dissipating portion via the insulating film and disposed between the insulating film and the heat-dissipation target
Implementation Method 2
an insulating film covering a contact surface of the heat-dissipating portion, the contact surface being configured to come into contact with the heat-dissipation target
Implementation Method 3
at least one heat-generating component that generates heat as a result of a current flowing therethrough
Data Source
AI summary
Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating components that generate heat as a result of a current flowing therethrough; a case accommodating the heat-generating components; metal plates connected to connecting portions of the heat-generating components, and each having a heat-dissipating portion exposed to an outside of the case and configured to come into thermal contact with an external heat-dissipation target; insulating films covering a contact surface of the heat-dissipating portion, the contact surface being configured to come into contact with the heat-dissipation target; and a thermal conductive filling member that is in thermal contact with the heat-dissipating portion via the insulating films and disposed between the insulating films and the heat-dissipation target.