Insulated Conductor Layout for Higher Withstand Voltage

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Solution Overview

Problem

The concentration of electric field on the high voltage conductor pattern leads to a detriment in improving withstand voltage in electronic components with low and high voltage conductor patterns facing each other across an insulating layer.

Innovation Solution

Incorporating a withstand voltage enhancement structure of conductive property that protrudes further outside than the low voltage conductor pattern and forms an electric field enhancement structure between the high voltage and low voltage wirings within the insulating layer, effectively shielding and distributing the electric field.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a low voltage conductor pattern and a high voltage conductor pattern are arranged to face each other across an insulating layer, then the electrical functionality is achieved, but electric field concentration occurs at the high voltage conductor pattern side which deteriorates withstand voltage

Engineering Contradiction:

Improvewithstand voltageVSAvoidelectric field concentration

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A withstand voltage enhancement structure of conductive property is introduced as an intermediary element between the high voltage conductor pattern and the low voltage conductor pattern. This structure protrudes further outside than the low voltage conductor pattern in plan view and is positioned closer to the high voltage conductor pattern, effectively mediating the electric field distribution and preventing direct concentration at the high voltage conductor pattern side.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention converts the harmful electric field concentration into a beneficial distributed electric field pattern. By positioning the withstand voltage enhancement structure closer to the high voltage conductor pattern, the electric field is intentionally redirected and distributed across a broader area, transforming the concentration problem into a controlled distribution that enhances withstand voltage.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If the withstand voltage enhancement structure protrudes further outside than the low voltage conductor pattern, then electric field distribution is improved, but the structural complexity increases

Engineering Contradiction:

Improvewithstand voltageVSAvoidconductor pattern structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The withstand voltage enhancement structure serves multiple functions simultaneously: it enhances withstand voltage by redistributing the electric field, acts as an additional conductive element for electrical connectivity, and provides structural support within the insulating layer. This multi-functionality justifies the additional structural element by delivering multiple benefits from a single addition.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration relaxes the electric field concentration on the high voltage conductor pattern, enhancing the withstand voltage by increasing the electric field strength at the high dielectric breakdown strength layer while reducing it at the lower dielectric breakdown strength layer, thereby preventing dielectric breakdown.

Implementation Method 1

an electric field is formed in a region between the low voltage conductor pattern and the high voltage conductor pattern

Methodology Applied

Scientific EffectElectric Field: Electric Field

Implementation Method 2

a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern

Methodology Applied

Scientific EffectElectrostatic Induction: Electrostatic Induction

Data Source

PatentUS20250336598A1Electronic component and electronic component module

Publication Date: 2025.10.30 ROHM CO LTD

AI summary

An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.