Insulated Gold Bond Wire Coating for Dense Stacked IC Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bare bond wires in integrated circuit packages are susceptible to contact and shorting, leading to manufacturing yield issues, especially in densely packed large scale and dual stack integrated circuits, due to insufficient strength and arc stability.
Innovation Solution
A method involving the preparation of gold-cobalt-lanthanum-cerium-germanium alloy rods, followed by stretching, annealing, activation, and sputtering a high-performance polyaryletherketone coating to form insulated spherical weld gold wires with enhanced tensile strength and arc stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bare bond wires are used in densely packed integrated circuit packages, then the manufacturing process is simple, but the wires are susceptible to contact and shorting, leading to manufacturing yield issues
Solution Approach 1:
The patent applies composite materials by combining gold wire with polyaryletherketone coating material to create an insulated bond wire. The coating layer is applied over the gold wire substrate, forming a composite structure that provides both electrical conductivity (from gold) and insulation (from polyaryletherketone). This resolves the contradiction by enabling reliable insulation in densely packed packages while maintaining a manageable manufacturing process through sequential coating and curing steps.
2Strength
If trace elements like beryllium, cerium, silver are added to gold alloy to refine grain and strengthen, then the alloy strength improves, but the long radian and arc stability requirements are difficult to meet
Solution Approach 1:
The patent applies parameter changes by modifying the alloy composition parameters - using pure gold or gold with minimal trace elements (0.003%-0.03%) instead of conventional alloys with higher trace element content. This parameter adjustment maintains adequate strength while significantly improving arc stability and long radian characteristics. The coating application parameters (thickness 0.5-2 μm, curing temperature 80-150°C) are also optimized to preserve wire flexibility and arc performance.
3Volume of moving object
If the electrode spacing is narrowed and packaging density is reduced to achieve smaller microchips, then the chip size decreases, but the bare wires become more susceptible to contact and short circuit
Solution Approach 1:
The patent applies flexible shells and thin films by coating the gold wire with a thin layer of polyaryletherketone (0.5-2 μm thickness). This thin film provides effective insulation for narrowed electrode spacing while maintaining wire flexibility and not significantly increasing the overall package volume. The coating acts as a protective shell that prevents contact and shorting in densely packed configurations, enabling continued miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The insulated wires prevent contact and shorting during packaging, maintain product performance, and reduce the heat-affected zone, ensuring regular arcs and improved bonding smoothness.
Implementation Method 1
step S4: annealing treatment: placing the spherical weld gold wire prepared in step S3 in a continuous annealing system, using high-purity nitrogen as a protective gas, at a temperature of 300° C.-600° C. and a speed of 40 m-80 m/min to perform a continuous annealing treatment to achieve the required breaking force and elongation
Implementation Method 2
meanwhile, applying ultrasonic waves with a power of P045 and a frequency of 8 kHz-40 kHz to the solution, performing activation treatment at a speed of 40 m-80 m/min
Implementation Method 3
step S6: sputtering an insulating coating: diluting the high-performance polyaryletherketone coating to a concentration of 8%-15% using acetone, and adjusting the sputtering pressure to be 0.1 MPa-0.3 MPa; passing the wire through an annular outlet with a pressure of 0.15 MPa-0.2 MPa at a speed of 100 m/min-200 m/min, performing high-performance polyaryletherketone coating sputtering on wire surface
Data Source
AI summary
The present invention discloses a method for manufacturing an insulated spherical weld gold wire for integrated circuit double-layer stacked package, which relates to the technical field of microelectronic packaging spherical weld gold wires, and specifically comprises the following steps: alloy sheet preparation; alloy rod preparation; stretching; annealing treatment; activation treatment; sputtered insulating coating; multi-winding and sub-packaging, since the polyaryletherketone insulating coating is provided on the surface of the spherical weld gold wire in a scaled integrated circuit and the double-layer stacked package of the present invention, the spherical weld gold wire is allowed to contact and cross during packaging, without affecting the product performance, cost and quality; two high-hardness and high-conductivity materials of cobalt and germanium are added, which greatly enhances the tensile strength of the material.