Insulated Metal Guide Plate for High-Frequency Contact Pin Testing
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Solution Overview
Problem
Conventional guide plates used in semiconductor package testing suffer from signal interference and noise issues between electrically conductive contact pins due to insufficient insulation, and have low rigidity leading to warpage and height deviations.
Innovation Solution
A guide plate with a metal body and a surface insulation layer formed by anodic oxide and deposition insulation films, which prevents signal interference and noise by maintaining insulation and enhancing durability through atomic layer deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulation material including ceramic, resin, and silicone is used in the guide plate, then electrical insulation is provided, but signal interference and noise between contact pins occur during high frequency testing
Solution Approach 1:
The guide plate uses a composite structure combining a metal body (aluminum or aluminum alloy) with an anodic oxide film insulation layer. This composite material provides both the electrical insulation needed to prevent short circuits and the signal shielding properties of metal to block high frequency interference and noise, resolving the contradiction between insulation and signal integrity.
2Stability of the object's composition
If a metal body is used to provide rigidity and prevent warpage, then structural stability is improved, but signal interference between contact pins may occur without proper insulation
Solution Approach 1:
The metal body provides the necessary rigidity and structural stability to prevent warpage, while the anodic oxide film formed on its surface provides both electrical insulation and signal shielding. This composite structure simultaneously achieves structural stability and prevents signal interference.
Solution Approach 2:
The anodic oxide film acts as an intermediary layer between the metal body and the external environment. It provides electrical insulation and signal shielding while allowing the metal body to maintain its structural stability and rigidity functions.
3Reliability
If conventional insulation materials are used, then electrical insulation is achieved, but the guide plate has low rigidity and experiences warpage leading to contact pin height deviation
Solution Approach 1:
By using a metal body instead of conventional insulation materials like ceramic, resin, or silicone, the guide plate achieves both excellent electrical insulation (through the anodic oxide film) and high rigidity. The metal body inherently provides structural stability that prevents warpage and contact pin height deviation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents signal interference and noise, ensures accurate high-frequency testing, and provides high abrasion resistance and durability against sliding friction.
Implementation Method 1
the surface insulation layer may include an anodic oxide insulation film famed by anodizing the metal body
Implementation Method 2
the surface insulation layer may include a deposition insulation film formed by atomic layer deposition
Data Source
AI summary
Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.