Insulated Land Substrate Layout for Fine-Pitch Chip-Scale Packaging
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Solution Overview
Problem
The manufacturing of near chip scale packages with small area substrates is challenging due to their thin, fine pitch, and small size, making them difficult to produce consistently while meeting industry demands for more functionality in smaller devices, and existing methods are not cost-effective or efficient in supporting alternative conductive interconnect structures.
Innovation Solution
A method and structure for forming semiconductor packages using a molded substrate with a conductive substrate having lands separated by grooves, filled with an insulating layer, and conductive patterns deposited on the land surfaces, allowing for a thin profile and adaptable configurations for attachment to a next level of assembly, which simplifies the formation of conductive circuit patterns and reduces the package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If near chip scale packages with small area substrates are manufactured using conventional methods, then the package size is reduced to meet industry demands, but the manufacturing consistency and reliability deteriorate due to thin, fine pitch characteristics
Solution Approach 1:
The substrate is segmented into distinct lands separated by grooves, with insulating material filling the grooves. This segmentation allows each land to be independently formed and connected to the conductive substrate, improving manufacturing consistency while maintaining small package size. The grooves act as natural separation features that simplify the formation of fine-pitch conductive patterns.
Solution Approach 2:
The insulating material is disposed along the sidewall surfaces of the lands before the conductive patterns are formed. This preliminary action of insulating the land sidewalls prevents unintended electrical connections during subsequent manufacturing steps, ensuring reliable electrical isolation while maintaining the fine-pitch layout required for small package size.
2Length of stationary object
If the substrate thickness is reduced to achieve a thin profile, then the package becomes more compact, but the structural strength and ease of manufacture worsen
Solution Approach 1:
The substrate employs a composite structure combining conductive substrate material with insulating material filled in the grooves between lands. This composite approach allows the use of thinner substrates while maintaining structural integrity, as the insulating material provides mechanical support and electrical isolation simultaneously, facilitating easier manufacture of thin-profile packages.
3Adaptability or versatility
If fine-pitch conductive patterns are formed on small area substrates, then the functionality increases, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The conductive substrate is divided into multiple lands separated by grooves, allowing fine-pitch conductive patterns to be formed on each land independently. This segmentation simplifies the manufacturing process by breaking down the complex task of creating fine-pitch patterns across the entire substrate into manageable sections, while still achieving high functionality through the multiple conductive regions.
Solution Approach 2:
The insulating material acts as an intermediary between adjacent lands, providing electrical isolation while allowing the conductive patterns on each land to be formed independently. This intermediary structure simplifies manufacturing by preventing electrical interference between fine-pitch patterns on adjacent lands, enabling higher functionality without proportionally increasing manufacturing complexity.
4Ease of operation
If lands are exposed to the outside as output pads, then the attachment to next level assembly is facilitated, but the package structure becomes more complex
Solution Approach 1:
The substrate structure segments the conductive regions into exposed lands that serve as output pads, while the grooves between them are filled with insulating material. This segmentation naturally creates discrete attachment points on the substrate surface, facilitating ease of connection to next level assembly without requiring additional complex interconnection structures.
Solution Approach 2:
The lands serve multiple functions: they provide electrical connection points, structural support, and attachment interfaces for next level assembly. By making the lands exposed to the outside, the structure achieves multi-functionality that simplifies the overall design, eliminating the need for separate interconnection elements and reducing structural complexity despite the exposed configuration.
Data Source
AI summary
In one embodiment, an electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns and a package body encapsulating the top surface of the insulating material and the electronic device, wherein the bottom land surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer.