Insulated Leadframe Chip Module Integration Density
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Solution Overview
Problem
Current chip modules face challenges in increasing integration density while maintaining the same outer dimensions and contact pad arrangements, especially due to the need for mechanical and electrical isolation between semiconductor chips, which limits their performance in complex applications and increases costs.
Innovation Solution
A chip module design featuring a leadframe with electrically insulated areas, where a chip is arranged partially on each area, using insulating adhesives to prevent short-circuits and secure the chip's position, and conductive adhesives for connecting additional chips, allowing for increased integration density without altering the module's dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor chips are arranged on separate mechanically and electrically isolated leadframe areas, then electrical insulation between chips is ensured, but integration density is reduced
Solution Approach 1:
The leadframe is divided into multiple electrically insulated areas (first leadframe area and second leadframe area) that are mechanically connected but electrically isolated. This segmentation allows different chips to be mounted on separate insulated areas while maintaining mechanical stability through the common leadframe structure, thus achieving both electrical insulation and high integration density.
Solution Approach 2:
The patent combines multiple leadframe areas into a single mechanically integrated leadframe structure. The first and second leadframe areas are mechanically connected forming one unified leadframe, which provides both mechanical support and electrical isolation pathways. This merging allows chips to be densely packed while maintaining electrical insulation through the segmented electrical paths within the unified mechanical structure.
2Quantity of substance
If integration density is increased by arranging more chips, then more functions are integrated, but outer dimensions and contact pad arrangements must be retained
Solution Approach 1:
The patent utilizes the vertical dimension and spatial arrangement within the existing planar footprint to increase integration density. By arranging chips on different insulated areas of the leadframe and using multi-layer adhesive structures, the design accommodates more chips without increasing the outer dimensions, effectively utilizing three-dimensional space within the constrained two-dimensional footprint.
3Reliability
If chips are arranged on insulated areas, then electrical isolation is achieved, but mounting complexity increases
Solution Approach 1:
The leadframe serves multiple functions simultaneously: it provides mechanical support for the chips, establishes electrical isolation between different chip areas, and maintains the overall structural integrity of the module. The adhesive layers also serve dual purposes of mechanical bonding and electrical insulation. This multi-functionality reduces mounting complexity by eliminating the need for separate components or processes for each function.
Data Source
AI summary
In various embodiments, a chip module may include a first chip; and a leadframe with a first leadframe area and a second leadframe area, wherein the first leadframe area is electrically insulated from the second leadframe area; wherein the first chip is arranged at least partially on the first leadframe area and at least partially on the second leadframe area.