Insulator-Coated Magnetic Shielding Material for Semiconductor Packages
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Solution Overview
Problem
Existing semiconductor packages face vulnerabilities in magnetic shielding, particularly around electrical connectors, due to the conductive nature of magnetic shielding materials when high particle loading is required, which can lead to electrical shorting and inadequate protection against magnetic interference.
Innovation Solution
Incorporating ferromagnetic particles with insulating coatings into a non-conductive epoxy matrix to create a non-conductive magnetic fill material with a controlled particle-to-mixture volume ratio, ensuring effective magnetic shielding without conductivity, thereby protecting semiconductor dies from magnetic fields while maintaining electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If high particle loading of ferromagnetic particles is used in magnetic shielding material, then magnetic shielding effectiveness is improved, but electrical conductivity increases causing electrical shorting
Solution Approach 1:
An insulating coating layer is introduced as an intermediary between ferromagnetic particles, preventing direct electrical contact while allowing magnetic field interaction. This mediator resolves the contradiction by blocking electrical conduction paths without interfering with magnetic shielding effectiveness.
Solution Approach 2:
The magnetic shielding material is formulated as a composite consisting of ferromagnetic particles, insulating coating material, and epoxy matrix. This composite structure enables simultaneous achievement of high magnetic permeability through particle loading while maintaining electrical insulation through the insulating components.
2Reliability
If ferromagnetic particles are coated with insulator, then electrical non-conductivity is improved, but magnetic permeability may deteriorate
Solution Approach 1:
The insulating coating thickness is precisely controlled within specific ranges (e.g., 0.1-10 micrometers) to optimize the balance between electrical insulation and magnetic permeability. By adjusting this critical parameter, both requirements are satisfied without significant compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides robust magnetic shielding across semiconductor packages, particularly around electrical connectors, by maintaining non-conductivity and ensuring adequate magnetic permeability, thus preventing electrical shorting and enhancing protection against magnetic interference.
Implementation Method 1
Ferromagnetic metals and their alloys having high magnetic permeability are effective shields for static and low frequency EMR
Data Source
AI summary
A non-conductive magnetic shield material is provided for use in magnetic shields of semiconductor packaging. The material is made magnetic by the incorporation of ferromagnetic particles into a polymer matrix, and is made non-conductive by the provision of an insulating coating on the ferromagnetic particles.


