Insulated Signal Transmission Module With Series Transformers
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Solution Overview
Problem
Current signal transmission devices face challenges in achieving high dielectric breakdown voltage and efficient signal transmission while minimizing noise and inductance, particularly in insulated gate drivers used in semiconductor circuits.
Innovation Solution
The signal transmission device employs a configuration with two transformers connected in series, each comprising a primary and secondary coil, and an insulation plate, where the transformers are integrated with element insulation layers and electrode pads to enhance dielectric breakdown voltage and reduce inductance, allowing for effective pulse signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transformer is used for signal transmission between primary and secondary circuits, then electrical insulation is achieved, but inductance and noise increase
Solution Approach 1:
The transformer is divided into two separate transformers connected in series, with each transformer having its own independent insulation structure. This segmentation allows the primary and secondary circuits to be isolated more effectively, reducing noise and inductance while maintaining high dielectric breakdown voltage through the combined insulation effect of both transformers.
Solution Approach 2:
An insulation plate is introduced as an intermediary element between the primary and secondary circuits. This insulation plate acts as a mediator that provides electrical isolation without requiring direct transformer coupling, thereby reducing the inductance and noise associated with traditional transformer designs while maintaining the necessary dielectric breakdown voltage.
2Reliability
If insulation thickness is increased to achieve higher dielectric breakdown voltage, then electrical insulation improves, but device size increases
Solution Approach 1:
The insulation structure uses composite materials combining multiple insulation layers and the insulation plate. This composite approach provides high dielectric breakdown voltage through the synergistic effect of different insulation materials, achieving the required electrical insulation without requiring excessive thickness of any single material, thus minimizing device size.
Solution Approach 2:
The insulation design transitions from a single-dimensional thickness approach to a multi-dimensional structure involving stacked insulation layers and the insulation plate positioned between primary and secondary circuits. This dimensional approach distributes the insulation function across multiple layers and spatial arrangements, achieving high dielectric breakdown voltage without proportionally increasing overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the dielectric breakdown voltage, reduces noise and inductance, and enables efficient signal transmission between the primary and secondary circuits, improving the overall performance of the signal transmission device.
Implementation Method 1
a transformer that electrically insulates the primary-side circuit from the secondary-side circuit and transmits a signal from the primary-side circuit to the secondary-side circuit
Data Source
AI summary
A signal transmission device provided with an insulated chip. The insulated chip includes: an element insulating layer; and a first insulated element and a second insulated element which are provided in the element insulating layer. The first insulated element includes a first front-surface-side electrically conductive portion and a first back-surface-side electrically conductive portion. The second insulated element includes a second front-surface-side electrically conductive portion and a second back-surface-side electrically conductive portion. The first back-surface-side electrically conductive portion and the second back-surface-side electrically conductive portion are electrically connected to each other. The first front-surface-side electrically conductive portion is electrically connected to a primary-side circuit via the first pad. The second front-surface-side electrically conductive portion is electrically connected to a secondary-side circuit via the second pad.


