Insulated Multi-Chip Semiconductor Layout for Bidirectional Communication
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently integrating multiple semiconductor chips with different power supply voltages while maintaining electrical insulation and bidirectional communication between them.
Innovation Solution
The semiconductor device employs a configuration with two electrically insulated circuit blocks, each with its own power supply voltage, using common semiconductor chips with symmetrical pad layouts and wire bondings to facilitate bidirectional communication and reduce development and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips with different power supply voltages are integrated, then functional versatility is improved, but device complexity increases due to the need for electrical insulation between different voltage domains
Solution Approach 1:
The semiconductor device is divided into multiple electrically insulated circuit blocks, each operating at different power supply voltages. This segmentation allows independent voltage domains to coexist without electrical interference, enabling functional versatility while managing complexity through modular isolation.
Solution Approach 2:
Electrically insulated circuit blocks serve as intermediaries that enable communication between different voltage domains without direct electrical connection. This mediator approach allows signal transmission across voltage boundaries while maintaining electrical insulation, resolving the contradiction between versatility and complexity.
2Ease of manufacture
If common semiconductor chips with symmetrical pad layouts are used, then manufacturing cost is reduced, but achieving bidirectional communication with different power supply voltages becomes more difficult
Solution Approach 1:
While the physical chip layout remains symmetrical for manufacturing efficiency, the electrical configuration is made asymmetric through selective connection to different power supply voltages in different circuit blocks. This allows common chips to serve multiple functional roles with different voltage requirements.
Solution Approach 2:
Common semiconductor chips with identical pad layouts are designed to perform multiple functions by being connected to different power supply voltages in different circuit blocks. This universal design reduces manufacturing costs while the electrical insulation and voltage selection enable bidirectional communication capabilities.
3Reliability
If electrical insulation is maintained between circuit blocks, then reliability is improved, but bidirectional communication between different power supply voltages becomes challenging
Solution Approach 1:
Electrically insulated circuit blocks act as intermediaries that enable safe communication between different voltage domains. The insulation prevents direct electrical connection and potential hazards, while still allowing controlled signal transmission for bidirectional communication.
Solution Approach 2:
The patent uses common semiconductor chips as copies with identical physical structures, which are then electrically configured differently in different circuit blocks. This copying approach maintains reliability through insulation while enabling communication by replicating the same chip design in multiple voltage domains.
Data Source
AI summary
A semiconductor device includes a first chip and a second chip. Each chip includes a high-side pad that receives a high-side voltage, a low-side pad that receives a low-side voltage, two or more control pads, an input pad, an output pad, and a functional circuit. In each chip, the two or more control pads are each pulled down to the low-side voltage or pulled up to the high-side voltage. In each chip, the two or more control pads include a target control pad that receives an external control signal. In each chip, an internal control signal is generated on the basis of two or more signals applied to the two or more control pads, and an operation of the functional circuit is controlled on the basis of the internal control signal.