Insulated Posts with Vertical Cooling Channels for PCB Thermal Management
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Solution Overview
Problem
Conventional heat sinks are inadequate in removing sufficient heat from electronic assemblies operating at high power levels, leading to thermal management challenges due to additional bonding layers and thermal resistance, necessitating compact thermal management solutions.
Innovation Solution
The thermal management assembly incorporates a heatsink with a manifold and a thermal compensation base layer thermally connected to the electronic assembly, featuring electrically insulated posts with vertical cooling channels forming fluid paths through the printed circuit board to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks are used, then heat dissipation is provided, but additional bonding layers and thermal interface materials are required which add size and thermal resistance
Solution Approach 1:
The patent merges the electrical insulation function and thermal conduction function into a single integrated post structure. The electrically insulated post incorporates cooling channels directly within it, combining structural support, electrical isolation, and heat dissipation functions that were previously separate components (posts, thermal interface materials, and cooling structures), thereby reducing the number of bonding layers and interface materials required.
Solution Approach 2:
The electrically insulated post serves multiple functions simultaneously: it provides mechanical support for the PCB, provides electrical insulation between conductive elements, and acts as a heat conduction path with integrated cooling channels. This multi-functionality eliminates the need for separate thermal interface materials and simplifies the overall assembly structure.
2Temperature
If conventional heat sinks are used, then heat dissipation is provided, but substantial thermal resistance is added to the electronic assembly
Solution Approach 1:
The patent extracts the cooling function from a separate heat sink component and integrates it directly into the electrically insulated post structure. By forming cooling channels within the posts themselves, the design eliminates thermal interface materials that would otherwise be required between separate heat sink and PCB components, thereby reducing substantial thermal resistance.
Solution Approach 2:
The cooling channels are nested within the electrically insulated posts, creating a compact structure where the cooling function is embedded inside the structural support elements. This nesting approach eliminates the need for external heat sinks and reduces thermal resistance by creating direct thermal pathways without additional interface layers.
3Power
If electronic assemblies operate at increased power levels, then higher electrical performance is achieved, but high heat flux is generated requiring more complex thermal management
Solution Approach 1:
The patent introduces vertical cooling channels within the electrically insulated posts, adding a vertical dimension to heat dissipation pathways. This three-dimensional cooling approach allows heat to be conducted away from high-power areas through the posts in the vertical direction, providing effective thermal management for high power density electronic assemblies without requiring complex external cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces operating temperatures of electronic assemblies by utilizing a fluid circuit that connects the heatsink manifold to a cooling manifold, thereby improving thermal management and reducing packaging size.
Implementation Method 1
The thermal compensation base layer is configured to thermally connect the heatsink and the electronic assembly
Implementation Method 2
a fluid circuit that connects the heatsink manifold to a cooling manifold... utilizing a fluid circuit that connects the heatsink manifold to a cooling manifold disposed through the printed circuit board
Data Source
AI summary
Thermal management assemblies for cooling an electronic assembly disposed on a PCB are disclosed. The thermal management assembly includes a heatsink, a heatsink manifold formed through the heatsink and a thermal compensation base layer coupled to the heatsink. The heatsink manifold has a fluid inlet and a fluid outlet. The thermal compensation base layer thermally connects the heatsink and the electronic assembly. The thermal management assembly further includes a cooling manifold disposed through the PCB to form a fluid flow path. Two or more electrically insulated posts are disposed between the heatsink manifold and the cooling manifold. Individual electrically insulated posts have a vertical cooling channel. At least one electrically insulated post fluidly connects the fluid inlet to the cooling manifold to form an upward fluid path. At least one electrically insulated post fluidly connects the cooling manifold to the fluid outlet to form a downward fluid path.