Insulated Power Module Layout for Compact Cooling and Assembly
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Solution Overview
Problem
Current power modules for electric vehicles and data centers face challenges such as high height and weight, inefficient space usage, limited heat dissipation, complex assembly, and high costs due to their sequential internal structure and mask-type housing insulation, which hinder power density and assembly efficiency.
Innovation Solution
A power module design featuring a primary and secondary converting unit, transformer, and heat dissipating units arranged on either side of an insulating plate with a semi-conducting layer, allowing for compact, efficient heat dissipation and simplified assembly, with options for air-cooling or liquid-cooling and a zinc spraying layer for electrical safety and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the high voltage chamber and low voltage chamber are arranged in parallel with sequential internal structure, then the power module provides adequate insulation and functional separation, but the height of the module becomes large and the cable connection becomes difficult
Solution Approach 1:
The patent transitions from a vertical parallel arrangement of high voltage and low voltage chambers to a horizontal planar layout. The insulating plate is positioned horizontally to divide the power module into high voltage and low voltage regions, changing the spatial dimension from vertical stacking to horizontal separation. This dimensional change reduces the height of the power module while maintaining adequate insulation distance between high voltage and low voltage components.
2Reliability
If mask-type housing insulation is used for the housing, then the power module achieves adequate electrical insulation, but the size, weight and cost of the module increase
Solution Approach 1:
The patent extracts the insulation function from the housing structure and relocates it to a dedicated insulating plate positioned between high voltage and low voltage components. This separation allows the housing to be simpler and lighter, while the insulating plate provides the necessary electrical insulation. The insulating plate can be made from lightweight materials such as ceramic or plastic, reducing the overall weight compared to a heavy mask-type housing insulation structure.
3Productivity
If the power devices are arranged unreasonably with oblique transformer layout, then the power module provides functional completeness, but the space utilization becomes low and power density decreases
Solution Approach 1:
The patent employs asymmetric layout optimization where the transformer is positioned in the low voltage region with its windings and core arranged to minimize space occupation. The high voltage and low voltage components are distributed asymmetrically across the horizontal plane, with the insulating plate strategically positioned to allow compact arrangement of power devices. This asymmetric arrangement improves space utilization and power density compared to symmetric or conventional layouts.
4Temperature
If a total wind tunnel with large length is used for heat dissipation, then the power module provides comprehensive cooling coverage, but the wind resistance becomes large and heat dissipation capability is limited
Solution Approach 1:
The patent segments the heat dissipation system into multiple localized cooling channels and wind tunnels distributed across different regions of the power module. Instead of one long wind tunnel, multiple shorter cooling passages are created between the insulating plate and housing, allowing air to flow through various regions simultaneously. This segmentation reduces wind resistance in each individual channel while providing comprehensive cooling coverage across the entire power module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances power density, simplifies assembly, improves heat dissipation, and reduces costs by allowing for compact, efficient, and safe power module design suitable for electric vehicles and data centers, while maintaining compatibility with both air-cooling and liquid-cooling systems.
Implementation Method 1
an insulating plate (50) comprising an insulating plate body and a semi-conducting layer disposed on a surface of the insulating plate body; wherein the primary converting unit, the primary unit and the first heat dissipating unit are located at a first side of the insulating plate, the secondary converting unit, the secondary unit and the second heat dissipating unit are located at a second side of the insulating plate
Implementation Method 2
a first heat dissipating unit on which the primary unit and the first active device unit are disposed; a second heat dissipating unit on which the secondary unit and the second active device unit are disposed
Implementation Method 3
improves heat dissipation
Implementation Method 4
a first heat dissipating unit on which the primary unit and the first active device unit are disposed; a second heat dissipating unit on which the secondary unit and the second active device unit are disposed
Implementation Method 5
with options for air-cooling or liquid-cooling and a zinc spraying layer for electrical safety and reduced size
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
The invention discloses a power module (100-1, 100-2, 100-3, 100-4) and a power conversion device (600). The power module includes a primary converting unit (10) including a first active device unit (11); a secondary converting unit (20) including a second active device unit (21); a transformer (30) including a primary unit (31) connected to the primary converting unit (10) and a secondary unit (32) connected to the secondary converting unit (20); a first heat dissipating unit (41) on which the primary unit (31) and the first active device unit (11) are disposed; a second heat dissipating unit (42) on which the secondary unit (32) and the second active device unit (21) are disposed; and an insulating plate (50) including an insulating plate body and a semi-conducting layer disposed on a surface of the insulating plate body.