Insulated Shielding Particle Mold Compound for Radiation-Tolerant Dies
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Solution Overview
Problem
There is a need for Radiation Tolerant (RT) semiconductors with reduced cost, as existing methods involve expensive manufacturing processes or ceramic packages.
Innovation Solution
Replace silicon dioxide filler particles with radiation-blocking materials like Ag—Sn alloy coated with SiO2, and disperse shielding particles coated with an electrically insulating coating in a base material to form a mold structure for die encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If radiation blocking materials are used to shield semiconductors, then radiation protection is improved, but manufacturing cost increases due to expensive ceramic packages or specialized fabrication processes
Solution Approach 1:
The patent replaces expensive ceramic packages and specialized RT fabrication processes with a cost-effective molding compound containing radiation-blocking particles dispersed in a standard epoxy base material. This allows conventional semiconductor manufacturing to be used while achieving radiation protection, significantly reducing manufacturing costs.
Solution Approach 2:
The invention creates a composite molding compound by dispersing radiation-blocking particles (such as bismuth, tungsten, or barium sulfate) in a standard epoxy base material with silicon dioxide filler. This composite provides both structural support and radiation protection, eliminating the need for expensive ceramic packages while maintaining cost-effective manufacturing.
2Object-affected harmful factors
If radiation blocking particles are added to the molding compound, then radiation shielding is achieved, but electrical conductivity may be affected
Solution Approach 1:
The patent applies local quality by coating radiation-blocking particles with an electrically insulating material such as silicon dioxide. This ensures that while the particles provide radiation shielding, their surface properties prevent electrical conduction paths, maintaining the electrical insulation requirements of semiconductor packages.
Solution Approach 2:
The electrically insulating coating acts as an intermediary between the conductive radiation-blocking particles and the surrounding epoxy matrix. This coating layer prevents direct electrical contact between particles, eliminating potential conduction paths while preserving the radiation-blocking functionality of the core particles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves radiation shielding without ceramic packages and alters the fabrication process, providing cost-effective radiation protection for semiconductors.
Implementation Method 1
coating shielding particles with an electrically insulating coating
Implementation Method 2
shielding particles comprising an electrically insulating coating... to shield the die from radiation
Data Source
AI summary
Methods to coat shielding particles with an electrically insulating coating, disperse the coated shielding particles in an base material to form a mold structure; and position the mold structure proximate a die of an integrated circuit package to shield the die from radiation. Devices comprising: a die; and a mold structure proximate the die, the mold structure comprising: an base material; and shielding particles comprising an electrically insulating coating, wherein the shielding particles are dispersed in the base material.