Insulated Transformer Chip With Layered Permittivity for HV Signal Isolation
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Solution Overview
Problem
Existing signal transmitting devices face challenges in efficiently transmitting pulse signals while maintaining electrical insulation between primary and secondary circuits, particularly in high-voltage applications, where the concentration of electric fields can lead to reliability issues and reduced performance.
Innovation Solution
The design incorporates a transformer chip with an element insulation layer that embeds high-voltage and low-voltage coils, utilizing a layered insulation structure with varying permittivity to alleviate electric field concentration, and a signal transmitting device configuration that includes a primary-side and secondary-side circuit connected through transformers to ensure insulation and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional insulation structure with uniform permittivity is used, then the device complexity is low, but electric field concentration occurs leading to reduced reliability
Solution Approach 1:
The patent applies local quality by dividing the insulation layer into multiple sub-layers with different permittivity values. The first insulation layer (with higher permittivity) is positioned closer to the primary coil, while the second insulation layer (with lower permittivity) is positioned closer to the secondary coil. This non-uniform distribution optimizes electric field management locally in different regions, reducing overall electric field concentration and improving signal transmission reliability without requiring complete structural redesign.
Solution Approach 2:
The patent employs composite materials by combining multiple insulation layers with different permittivity characteristics. This composite structure allows the system to leverage the advantages of different materials: the higher permittivity material provides better electric field confinement where needed, while the lower permittivity material reduces overall field strength. The composite approach achieves superior reliability compared to single-material solutions while maintaining manageable device complexity through systematic material selection.
2Reliability
If the insulation layer thickness is increased, then electrical insulation performance improves, but the device volume increases
Solution Approach 1:
The patent applies parameter changes by varying the permittivity parameter across different insulation layers rather than uniformly increasing thickness. By using a first insulation layer with higher permittivity and a second insulation layer with lower permittivity, the system achieves enhanced electrical insulation performance through optimized electric field distribution. This approach provides better insulation effectiveness per unit thickness, thereby reducing the overall volume required compared to conventional uniform-thickness designs.
Solution Approach 2:
The patent transitions from a single-dimension solution (uniform thickness) to a multi-dimensional solution by introducing permittivity variation as an additional design dimension. Instead of solely relying on increased thickness to improve insulation, the system utilizes permittivity as another controllable parameter. This dimensional shift allows achieving superior insulation performance with reduced volume by optimizing the electric field distribution pattern rather than simply adding more material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces electric field intensity and concentration, enhancing the reliability and performance of signal transmission in high-voltage applications by ensuring efficient insulation and signal integrity.
Implementation Method 1
a transformer chip with an element insulation layer that embeds high-voltage and low-voltage coils, utilizing a layered insulation structure with varying permittivity to alleviate electric field concentration
Implementation Method 2
utilizing a layered insulation structure with varying permittivity to alleviate electric field concentration
Implementation Method 3
a signal transmitting device configuration that includes a primary-side and secondary-side circuit connected through transformers to ensure insulation and signal transmission
Data Source
AI summary
This transformer chip includes an element insulating layer and a high-voltage coil and a low-voltage coil embedded in the element insulating layer. The high-voltage coil includes a first end face facing the low-voltage coil side in the z-direction, a second end face opposite the first end face, and a first side face. The element insulating layer includes a third insulating layer, a second insulating layer laminated on the third insulating layer and having a higher relative dielectric constant than the third insulating layer, and a first insulating layer laminated on the second insulating layer and having a lower relative dielectric constant than the second insulating layer. The high-voltage coil is provided within the first insulating layer with the first end face in contact with the second insulating layer.