Insulated Wire Adhesion Layer High Temperature Resistance
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Solution Overview
Problem
Existing insulated wires for electrical and electronic equipment face challenges in maintaining adhesion strength at high temperatures and providing adequate insulation and bending workability, particularly in high-temperature environments and when using varnishes with solvents.
Innovation Solution
Development of an insulated wire with a specific adhesion layer on the outer periphery of the conductor, comprising a resin without a melting point, having a tensile modulus of 0.6 × 10^7 to 10 × 10^7 Pa at 250°C, and containing substances with 2 or more amino groups, along with a film layer made from polyetherimide, polycarbonate, or polysulfone, which allows for strong fixation and high partial discharge inception voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thermosetting adhesive layer formed from epoxy-based resin composition is used, then adhesion strength is improved, but adhesion strength is lost at high temperatures (200°C or higher)
Solution Approach 1:
The patent changes the fundamental parameter of the adhesive material from thermosetting resin to thermoplastic resin, which eliminates the melting point limitation and maintains adhesion strength at high temperatures (200°C or higher) without the softening issue that plagues thermosetting adhesives
Solution Approach 2:
The patent creates a composite adhesion layer combining thermoplastic resin with specific additives (substances having 2 or more amino groups, metal oxides, or metal hydroxides) to achieve both strong adhesion and high-temperature resistance simultaneously
2Ease of operation
If varnish using solvent is used to fix insulated wire, then fixation is achieved, but manufacturing complexity and environmental concerns increase
Solution Approach 1:
The patent extracts and eliminates the solvent component from the adhesive system, using only thermoplastic resin that can be applied and activated through heat treatment alone, thereby simplifying the manufacturing process and eliminating solvent-related environmental and safety concerns
Solution Approach 2:
The patent replaces the chemical bonding mechanism of solvent-based varnishes with a thermal bonding mechanism using thermoplastic resin, where heat activation replaces the need for solvent evaporation and chemical curing processes
3Reliability
If insulated wire needs to maintain high PDIV and adhesion strength, then material composition becomes complex, but manufacturing ease is reduced
Solution Approach 1:
The patent optimizes the thickness parameter of the adhesion layer (2 to 200 μm) to achieve the desired PDIV performance while maintaining manufacturability, and controls the content ratio of substances having 2 or more amino groups (1 to 50 mass%) to balance performance and processing ease
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The insulated wire achieves strong adhesion, high partial discharge inception voltage, and excellent heat resistance, enabling reliable operation in high-temperature environments without the need for varnishes or solvents, thus enhancing the insulation and performance of coils and electronic equipment.
Implementation Method 1
the adhesion layer allows fixation to other parts with a strong adhesion force
Implementation Method 2
a resin constituting the adhesion layer does not have a melting point meaning that a crystal melting peak or a crystallization peak is not observed in a differential scanning calorimetric (DSC) analysis
Data Source
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AI summary
An insulated wire, having: a single conductor or multiple conductors; an insulating layer on the outer periphery of the single conductor or each of the multiple conductors; and an adhesion layer on the outer periphery of the insulating layer, wherein the thickness of the adhesion layer is 2 to 200 µm, wherein a resin constituting the adhesion layer does not have a melting point, wherein the resin constituting the adhesion layer has a tensile modulus of 0.6 × 107 to 10 × 107 Pa at 250°C, and wherein a substance having 2 or more amino groups exists on the surface of the adhesion layer; a coil containing the insulated wire; and an electrical or electronic equipment using the coil.