Insulated Electric Wire with Low Boiling Point Component for Bending Adhesion
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Solution Overview
Problem
The manufacturing of insulated electric wires with high adhesion, flexibility, and softening resistance for bending processes is complicated and costly, and existing methods struggle to maintain consistent product quality due to varying conductor shapes and insulating film thicknesses, leading to issues like peeling and wrinkles.
Innovation Solution
An insulated electric wire with a conductor coated by an insulating film containing 5 to 20% low boiling point components and a thickness of 40 to 65 μm, using a polyamide-imide or polyimide resin, and formed via electrodeposition, which enhances adhesion, flexibility, and softening resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bending radius is reduced in the edgewise bending process, then the performance of the reactor or motor is improved, but the insulating film is likely to peel from the conductor and wrinkles are likely to occur
Solution Approach 1:
The patent changes the chemical composition parameters of the insulating film by incorporating a specific low molecular weight component (5-20% by mass) with a glass transition temperature of -50°C or lower. This compositional parameter change enables the film to maintain flexibility and adhesion during bending while preserving insulation performance.
Solution Approach 2:
The insulating film is designed as a composite material combining a base polymer with a low molecular weight component (such as plasticizers or specific additives). This composite structure provides both the mechanical flexibility needed for bending and the adhesive properties required to prevent peeling, while maintaining electrical insulation.
2Reliability
If an insulating film with high adhesion is used to prevent peeling and wrinkles, then the insulation performance is maintained, but the manufacturing process becomes complicated and costs increase
Solution Approach 1:
The patent extracts and eliminates the primer layer from the manufacturing process. Instead of using a multi-layer structure with primer and topcoat, the invention achieves high adhesion directly through the insulating film's composition, which contains the low molecular weight component that provides both adhesion and flexibility.
Solution Approach 2:
By changing the compositional parameters of the insulating film (adding 5-20% low molecular weight component with Tg ≤ -50°C), the film inherently gains improved adhesion properties without requiring additional processing steps or primer layers, thus simplifying manufacturing.
3Ease of operation
If the insulating film is made thinner to improve flexibility, then the bending performance is improved, but the softening resistance decreases
Solution Approach 1:
The patent carefully controls the parameters of the low molecular weight component, specifying that it should have a glass transition temperature of -50°C or lower and constitute 5-20% by mass of the insulating film. This precise parameter control enables the film to remain flexible at operating temperatures while maintaining softening resistance through the base polymer matrix.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent adhesion and flexibility during bending, high insulation breakdown voltage, and heat resistance, preventing peeling and wrinkles, while simplifying the manufacturing process and reducing costs.
Implementation Method 1
the insulating film contains 5 to 20% by mass of a low boiling point component having a boiling point of less than 300° C. under normal pressure
Implementation Method 2
formed via electrodeposition
Data Source
AI summary
There is provided an insulated electric wire comprising a conductor wire coated by an insulating film, in which the insulating film contains 5 to 20% by mass of a low boiling point component having a boiling point of less than 300° C. under normal pressure. The insulating film preferably has a thickness of 40 to 65 μm. The conductor wire preferably has a cross-sectional shape in a rectangular shape or a square shape.