Insulated Wire Bond Semiconductor Package for Sensing
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Solution Overview
Problem
Current processes for producing sensing devices are complex and costly, necessitating a simplified and cost-effective method for manufacturing semiconductor packages that can accommodate sensing elements while ensuring reliable exposure to environmental parameters.
Innovation Solution
A semiconductor package design featuring a package substrate with a die region and insulated wire bonds exposed through access ports, where the die is electrically coupled to contact pads and covered by a cap, allowing direct environmental interaction without hermetic sealing or encapsulants, thus simplifying the production process and reducing material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetic sealing or encapsulants are used to protect sensing elements, then reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the hermetic sealing and encapsulant layers from the package structure, exposing the wire bonds and sensing elements directly to the environment through access ports. This extraction of protective layers simplifies the device structure while maintaining reliability through the insulated wire bond design and controlled access port configuration.
Solution Approach 2:
The patent employs a simplified package structure that eliminates expensive hermetic sealing materials and complex encapsulant processes. The design accepts that wire bonds are exposed but uses insulation coatings on the wire bonds themselves to provide sufficient protection, replacing expensive hermetic materials with more economical insulated wire bond technology.
2Reliability
If hermetic sealing or encapsulants are used to protect sensing elements, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent eliminates hermetic sealing and encapsulant materials from the manufacturing process, removing these costly steps while maintaining reliability through the insulated wire bond design. The access ports provide controlled environmental interaction without requiring expensive hermetic barriers.
Solution Approach 2:
The patent replaces expensive hermetic sealing materials and multi-step encapsulation processes with a simpler design using insulated wire bonds and basic access ports. This substitution of expensive materials with more economical alternatives reduces manufacturing cost while maintaining sufficient protection for the sensing elements.
3Measurement precision
If access ports are provided for direct environmental exposure, then sensing performance is improved, but wire bonds may be exposed to harmful environmental factors
Solution Approach 1:
The patent introduces an insulation coating on the wire bonds as an intermediary protective layer. This insulation acts as a mediator that allows the wire bonds to be exposed to the environment through access ports while still protecting them from harmful environmental factors such as moisture and corrosion, enabling both direct environmental sensing and wire bond protection.
4Device complexity
If the package structure is simplified without hermetic sealing, then manufacturing complexity is reduced, but protection of internal components may be compromised
Solution Approach 1:
The patent removes hermetic sealing and encapsulant layers to simplify the package structure, eliminating complex manufacturing steps. The simplified design uses access ports and insulated wire bonds instead, reducing manufacturing complexity while maintaining adequate protection through the insulation coating on exposed wire bonds.
Solution Approach 2:
The patent replaces expensive and complex hermetic sealing materials with a simpler insulated wire bond design. The insulation coating on the wire bonds provides sufficient protection against environmental factors without requiring expensive hermetic materials or complex encapsulation processes, achieving protection at lower complexity and cost.
Data Source
AI summary
Semiconductor packages and methods for forming a semiconductor package are presented. The semiconductor package includes a package substrate having a die region on a first surface thereof. The package includes a die having a sensing element. The die is disposed in the die region and is electrically coupled to contact pads disposed on the first surface of the package substrate by insulated wire bonds. A cap is disposed over the first surface of the package substrate. The cap and the first surface of the package substrate define an inner cavity which accommodates the die and the insulated wire bonds. The insulated wire bonds are directly exposed to an environment through at least one access port of the package.