Insulated Wire Bubble Layer Partial Discharge
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Solution Overview
Problem
Insulated wires for electrical equipment face challenges in achieving high partial discharge inception voltage, heat resistance, and durability due to limitations in insulating film thickness, adhesion, and corona discharge resistance, particularly in high-performance applications like aerospace and automotive systems.
Innovation Solution
Incorporating bubbles into the insulating film of enameled insulated wires by using a mixture of solvents with a high boiling point as a foaming agent, resulting in a thermosetting resin layer with fine bubbles, which enhances partial discharge inception voltage and heat resistance without compromising dielectric breakdown voltage or mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulating film is thickened to improve partial discharge inception voltage, then corona-discharge resistance improves, but the film thickness requirement cannot be met and production complexity increases
Solution Approach 1:
The patent introduces a porous structure within the insulating film by forming microbubbles during the varnish baking process. This porous structure increases the partial discharge inception voltage by disrupting discharge paths while maintaining a thin overall film thickness, thus resolving the contradiction between improving corona-discharge resistance and meeting thickness requirements.
Solution Approach 2:
The patent creates a composite insulating film structure combining a resin matrix with dispersed microbubbles. This composite structure provides both the mechanical integrity of the resin and the electrical performance enhancement from the bubbles, achieving high partial discharge inception voltage without increasing film thickness.
2Reliability
If particles are blended into the insulating film to improve corona-discharge resistance, then erosion deterioration reduces, but flexibility lowers and film surface becomes rough
Solution Approach 1:
The patent uses a porous microbubble structure instead of solid particles to improve corona-discharge resistance. The gas-filled bubbles provide electrical performance enhancement without the mechanical drawbacks of particle reinforcement, maintaining film flexibility and smooth surface finish.
Solution Approach 2:
The patent changes the physical state of the reinforcement phase from solid particles to gas bubbles. This parameter change fundamentally alters the interaction between the reinforcement and the resin matrix, providing electrical performance benefits without compromising mechanical properties like flexibility and surface smoothness.
3Reliability
If the number of baking times is increased to thicken the insulating film, then partial discharge inception voltage improves, but coating film strength decreases due to copper oxide thickening
Solution Approach 1:
The patent forms microbubbles within the insulating film during a single or limited number of baking cycles. This internal porous structure provides the electrical performance enhancement that would otherwise require multiple thickening bakes, thereby avoiding excessive copper oxide formation and preserving adhesion strength.
Solution Approach 2:
The patent achieves the desired partial discharge inception voltage through a controlled porous structure formed in a single or limited baking process, rather than applying excessive baking cycles that would lead to copper oxide thickening and adhesion loss. The bubble structure provides sufficient electrical performance with minimal thermal exposure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides insulated wires with improved partial discharge inception voltage, heat resistance, and abrasion resistance, making them suitable for high-performance electrical equipment with enhanced durability and reliability.
Implementation Method 1
Incorporating bubbles into the insulating film of enameled insulated wires by using a mixture of solvents with a high boiling point as a foaming agent, resulting in a thermosetting resin layer with fine bubbles
Implementation Method 2
a layer containing bubbles is formed as an insulating layer by baking a varnish of thermosetting resin
Data Source
Figure 1~2
Figure 3~4(c)
AI summary
An insulated wire, containing: an insulating film made from a thermosetting resin disposed on a conductor directly or via an insulating layer interposed therebetween, in which the insulating film made from a thermosetting resin is a layer containing bubbles prepared by baking a varnish of thermosetting resin, and a layer containing no bubbles is formed as an upper or lower layer of the layer containing bubbles.