Insulated Wire Path Plate Layout for Spark-Free Wire Bonding
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Solution Overview
Problem
In wire bonding processes, high potential differences cause sparking and friction between the bonding wire and conductive wire path plates, leading to uncontrollable wire tension, surface wear, and reduced durability due to sticking effects.
Innovation Solution
A wire path plate design featuring conductive plates with non-conductive strips along the upper and lower portions to insulate the bonding wire, minimizing contact and friction, and using ceramic or sapphire non-conductive rods to reduce sparking and wear.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conductive wire path plates are used for wire bonding, then electrical conductivity is improved, but sparking and friction occur leading to reduced durability
Solution Approach 1:
The wire path plate is segmented into multiple regions: conductive regions for electrical conductivity and non-conductive strip regions for reduced friction and sparking. This segmentation allows different portions of the plate to serve different functions simultaneously.
Solution Approach 2:
Different regions of the wire path plate have different material properties - the non-conductive strips provide low friction and anti-sticking properties where wire contact occurs, while other regions maintain conductivity. This local differentiation resolves the contradiction between conductivity and durability.
2Reliability
If bonding wire contacts conductive surfaces, then electrical connection is established, but sticking effects occur causing uncontrollable wire tension
Solution Approach 1:
The wire path plate is segmented into multiple regions: conductive regions for electrical conductivity and non-conductive strip regions for reduced friction and sparking. This segmentation allows different portions of the plate to serve different functions simultaneously.
Solution Approach 2:
Different regions of the wire path plate have different material properties - the non-conductive strips provide low friction and anti-sticking properties where wire contact occurs, while other regions maintain conductivity. This local differentiation resolves the contradiction between conductivity and durability.
3Ease of operation
If air flow is generated in the gap to create wire bend, then wire tension control is improved, but surface wear increases due to friction
Solution Approach 1:
Non-conductive strips act as intermediaries between the bonding wire and the conductive plate surface. These strips reduce direct metal-to-metal contact and friction, thereby reducing wear while still allowing the air flow to create the necessary wire bend for tension control.
4Strength
If high potential difference is applied for bonding, then bonding strength is improved, but sparking occurs causing surface degradation
Solution Approach 1:
Non-conductive strips act as intermediaries between the bonding wire and the conductive plate surface. These strips reduce direct metal-to-metal contact and friction, thereby reducing wear while still allowing the air flow to create the necessary wire bend for tension control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents sparking and sticking, maintains surface smoothness, and extends the lifespan of the wire path plate by reducing friction and wear, enhancing the reliability and repeatability of wire bonding operations.
Implementation Method 1
at least one non-conductive strip mounted along the upper and/or lower portions of at least one of the conductive plates for insulating the bonding wire from conductive surfaces
Implementation Method 2
An air flow A is generated within the gap in the wire path plate to form a bend in the bonding wire 16 inside the wire path plate 28, so as to create some laxity and a constant tension in the bonding wire 16
Implementation Method 3
high potential differences cause sparking and friction between the bonding wire and conductive wire path plates, leading to uncontrollable wire tension
Data Source
AI summary
A wire path plate for a wire bonding apparatus includes a first conductive plate coupled to a second conductive plate. Each conductive plate has an upper portion, a lower portion and a middle portion located between the upper and lower portions. A bonding wire is configured to be passed through a gap formed between the first and second conductive plates. At least one non-conductive strip is mounted along the upper and/or lower portions of at least one of the conductive plates for insulating the bonding wire from conductive surfaces of the at least one conductive plate at the position of the at least one non-conductive strip.