Thermally Insulating Adhesive for Logic Board Heat Isolation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

In consumer electronics, heat-generating components like the main logic board (MLB) attached to metal enclosures via adhesive materials create thermal short-circuits, limiting the effectiveness of air gaps as insulators due to high thermal conductivity of adhesives and standoffs, leading to uncomfortable or dangerous hotspots on the device casing.

Innovation Solution

A thermally-insulating material with a thermal conductivity less than 35 mW/m-K, coated with adhesive layers on both surfaces, is used to separate the MLB from the case enclosure, providing effective thermal insulation while maintaining structural integrity and adhering securely under pressure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive material is used to attach the main logic board to the case enclosure, then structural integrity and secure attachment are improved, but thermal conductivity increases causing heat transfer to the enclosure

Engineering Contradiction:

Improveattachment strengthVSAvoidheat transfer

Core Design Contradiction:

StrengthVSLoss of energy

Solution Approach 1:

A thermally insulating material with adhesive layers is introduced as an intermediary component between the main logic board and the case enclosure. This composite structure maintains the attachment function while blocking heat transfer, as the insulating material has low thermal conductivity despite the presence of adhesive layers.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution uses a composite material structure combining thermally insulating material with adhesive layers. This composite provides both mechanical attachment strength and thermal insulation properties, resolving the contradiction between needing strong attachment and preventing heat transfer.

Inventive Principle:

Principle #40Composite materials

2Loss of energy

If an air gap is created between the main logic board and the case enclosure using standoffs, then thermal insulation is improved, but device thickness increases

Engineering Contradiction:

Improveheat transferVSAvoiddevice thickness

Core Design Contradiction:

Loss of energyVSLength of moving object

Solution Approach 1:

The invention merges the thermal insulation function and the attachment function into a single integrated component. The thermally insulating material with adhesive layers combines the gap-creating insulation effect with the bonding effect, eliminating the need for separate standoffs and reducing overall device thickness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The composite insulating material with adhesive layers serves multiple functions simultaneously: it provides thermal insulation like an air gap, provides structural attachment like standoffs, and maintains device thinness. This multi-functionality resolves the contradiction between insulation and thickness.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Stability of the object's composition

If the thermal conductivity of adhesive and standoffs is greater than air, then structural support is maintained, but thermal short-circuit occurs reducing insulation effectiveness

Engineering Contradiction:

Improvestructural supportVSAvoidinsulation effectiveness

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The invention changes the thermal conductivity parameter of the attachment material by using low thermal conductivity insulating material instead of high thermal conductivity adhesive or metal standoffs. This parameter change maintains structural support while preventing thermal short-circuit, improving insulation reliability.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces heat transfer between the MLB and the case enclosure, maintaining device thinness while ensuring user safety by minimizing hotspot formation and adhering securely under various pressures.

Implementation Method 1

a first layer of thermally-insulating material having a thermal conductivity less than 35 mW/m-K

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

a second adhesive layer on a top surface of the thermally-insulating material, and a third adhesive layer on a bottom surface of the thermally-insulating material

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS10180709B1Thermally insulating adhesive

Publication Date: 2019.01.15 GOOGLE LLC

AI summary

A computing device includes a case enclosure, a heat-generating electrical component, and a thermal insulator. The thermal insulator has a first surface adhesively bonded to the surface of the case enclosure and has a second surface adhesively bonded to the surface of the heat-generating component. The thermal insulator includes a layer of thermally-insulating material between the first and second surfaces, and the thermally-insulating material has a thermal conductivity less than 35 mW/m-K.