Insulating Busbar Gap-Free Resin Encapsulation
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Solution Overview
Problem
Conventional busbars fail to achieve both high withstand voltage and low inductance due to exposed conductor ends and gaps between components, which can lead to discharge and increased inductance when trying to maintain high voltage and insulation.
Innovation Solution
An insulating busbar with a resin portion that covers all circuit conductors and connection terminals without gaps, formed using a resin injection mold under reduced pressure to ensure integral coverage and prevent air bubbles, along with a design that includes auxiliary circuit conductors and uneven portions to enhance creepage distance and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional busbar structure with exposed conductor ends is used, then manufacturing is simpler, but withstand voltage is reduced due to discharge risk
Solution Approach 1:
The patent merges the conductor, connection terminal, and insulating resin into a single integrated busbar structure. The resin portion is formed integrally around the conductors and terminals, eliminating separate insulation components and exposing no conductor ends, thereby achieving high withstand voltage without proportionally increasing structural complexity
Solution Approach 2:
The patent uses an insulating resin portion that completely covers the conductor and connection terminal, forming a protective shell structure. This resin shell encapsulates the conductive elements, preventing discharge and providing the necessary insulation for high withstand voltage applications
2Reliability
If gaps are present between circuit conductors and connection terminals, then manufacturing is easier, but inductance increases and discharge risk increases
Solution Approach 1:
The patent applies preliminary action by forming the insulating resin portion to completely cover the conductor and connection terminal before final assembly. The resin is injected and cured in place, pre-establishing the gap-free insulation structure that prevents discharge and reduces inductance
Solution Approach 2:
The patent changes the physical state and distribution of the insulating resin by controlling the injection pressure and curing parameters. By adjusting these parameters, the resin fills all gaps and voids completely, creating a dense, gap-free insulation structure that prevents discharge while maintaining manufacturing feasibility
3Manufacturing precision
If air bubbles are trapped in resin portion, then injection process is simpler, but insulation performance deteriorates and discharge may occur
Solution Approach 1:
The patent applies the skipping principle by rapidly injecting the insulating resin under controlled pressure to fill the mold cavity before air bubbles can become trapped. The injection process is optimized to complete the filling quickly and uniformly, ensuring complete coverage of the conductor and terminal without voids, thereby achieving high manufacturing precision while maintaining productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases insulation, prevents discharge, reduces inductance, and maintains high withstand voltage by ensuring complete resin coverage and optimized spacing, making it suitable for high-voltage semiconductor applications.
Implementation Method 1
by injecting insulating resin into the resin injection mold in a state where the absolute pressure inside the resin injection mold has been reduced to be less than or equal to 80 kPa
Data Source
AI summary
To realize an insulating busbar that has both low inductance and high withstand voltage, provided is an insulating busbar that connects to a module on which is mounted a semiconductor chip, including a plurality of circuit conductors; a plurality of connection terminals that respectively electrically connect the circuit conductors to the module; and an insulating resin portion that is formed integrally between each of the circuit conductors and at least a portion of a region around each connection terminal and does not have any gaps between the circuit semiconductors.