Insulating Cement Layer Retracted Region for Sensor Film
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Solution Overview
Problem
Conventional insulation structures in sensor devices suffer from surface roughness and voids formed during the bonding process, leading to corrosion and vulcanization of metal lines due to air contaminants entering these voids, compromising the reliability and quality of the final product.
Innovation Solution
An improved insulation protection structure where at least one surface of the insulating cement layer is retracted inward to form a retracted region, allowing for even adhesion of protective films and reducing the risk of corrosion, and can be cured at room temperature, eliminating the need for high-temperature and high-pressure environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional screen printing process is used to apply insulating glue, then the insulating glue can be easily applied to protect signal trace layer, but the surface roughness becomes severe and voids are generated between insulating glue and protective film
Solution Approach 1:
The insulating glue layer is designed with different properties in different regions: the peripheral region has increased thickness to provide better adhesion and eliminate voids, while the central region maintains appropriate thickness for insulation. This local variation in thickness distribution resolves the contradiction between ease of application and manufacturing precision.
Solution Approach 2:
The insulating glue is applied with a predetermined thickness distribution pattern before the protective film is applied. By pre-configuring the glue layer with thicker peripheral regions, the structure is prepared in advance to prevent void formation and ensure even adhesion, thereby resolving the surface roughness and void issues.
2Area of stationary object
If insulating glue edge is aligned with sensing substrate edge, then complete coverage is achieved, but protective film cannot be evenly adhered and voids are generated
Solution Approach 1:
The insulating glue layer is designed with different thicknesses in different regions: thicker at the periphery for better adhesion and void prevention, and appropriately thin in the center for insulation functionality. This local variation resolves the contradiction between coverage area and adhesion quality.
Solution Approach 2:
Instead of varying the lateral extent of the insulating glue layer, the solution varies the thickness dimension of the glue layer. By increasing thickness at the peripheral region while maintaining appropriate central thickness, the invention achieves both complete coverage and improved adhesion without void formation.
3Strength
If high-temperature and high-pressure curing is used for adhesive materials, then strong bonding is achieved, but bubbles and cavities are generated in low-temperature ultraviolet curing conditions
Solution Approach 1:
The curing parameters are changed from high-temperature and high-pressure conditions to low-temperature ultraviolet curing. This parameter change enables the adhesive to cure effectively without generating bubbles and cavities, while still achieving sufficient bonding strength through the optimized glue layer configuration.
4Ease of manufacture
If insulating glue surface is rough, then screen printing process is simple, but corrosive contaminants can easily attack metal lines along voids
Solution Approach 1:
The insulating glue layer is designed with different thicknesses in different regions to create a smoother effective surface. The thicker peripheral region provides a stable base that reduces surface roughness issues, thereby protecting metal lines from corrosive contaminant attack while maintaining the simplicity of the screen printing process.
Solution Approach 2:
The inherent surface roughness from screen printing is converted into a benefit by designing the glue layer with thicker peripheral regions. This configuration uses the rough surface characteristics to create a mechanical interlock that enhances adhesion and prevents void formation, thereby protecting against corrosion while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents corrosion and vulcanization of metal lines, enhancing the quality and yield of metal line circuits while simplifying and reducing the cost of the manufacturing process, and can be applied to various adhesive materials and films.
Implementation Method 1
since its internal adhesive materials cannot be cured and carried out through the conventional high-temperature and high-pressure environments in the packaging process, but only through a low-temperature ultraviolet curing condition
Data Source
AI summary
An improved insulation protection structure comprises a sensor film, a chip outline, a protective film, and an insulating cement layer. The chip outline is on the sensor film, the protective film is on the chip outline, the insulating cement layer is between the chip outline and the protective film. The insulating cement layer comprises at least one surface facing inward the chip outline, retracted toward the direction of the chip outline and forms a retracted region along at least one side of the sensor film. Area of the proposed retracted region is preferably no more than 20% of that of the total insulating cement layer, and the conventional issues such as sulphide corrosion are solved. The proposed insulating cement layer can be cured merely at room temperature, and widely used for adhesive materials including both a gel and film, thus characterized by wider application range and better industrial applicability.