Insulating Chip for Gate Driver Signal Isolation
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Solution Overview
Problem
Existing gate drivers face challenges in improving dielectric voltage and reducing manufacturing costs due to the need for separate insulating elements for low and high voltage circuits.
Innovation Solution
A gate driver configuration that includes a low voltage circuit and a high voltage circuit connected through a single insulating chip with multiple insulating elements, allowing for improved dielectric voltage and shared use of insulating chips across different voltage levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate insulating elements are used for low voltage and high voltage circuits, then insulation reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple insulating elements (first insulating element and second insulating element) into a single integrated insulating chip. This insulating chip includes a substrate with insulating layers and multiple embedded conductor patterns that form both insulating elements with different dielectric strengths, thereby reducing device complexity while maintaining insulation reliability through the integrated structure.
Solution Approach 2:
The insulating chip serves multiple functions: it provides both the first insulating element for low voltage circuits and the second insulating element for high voltage circuits within a single component. The conductor patterns on the substrate create multiple insulated connections, allowing one chip to replace what would traditionally require separate insulating components for different voltage levels.
2Reliability
If multiple separate insulating chips are used for different voltage circuits, then insulation performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges multiple insulating elements that would traditionally require separate chips into a single insulating chip. The chip includes a substrate with multiple insulating layers and embedded conductor patterns that create both the first and second insulating elements, allowing simultaneous provision of different dielectric strengths for low and high voltage circuits in one manufactured component.
Solution Approach 2:
The insulating chip uses composite material structures with multiple insulating layers having different dielectric properties. The substrate includes first and second insulating layers with different breakdown voltages, and conductor patterns embedded within these layers, creating a composite structure that provides differentiated insulation performance for different voltage requirements within a single chip.
3Device complexity
If a single insulating element is used for both low and high voltage circuits, then device complexity is reduced, but dielectric voltage performance deteriorates
Solution Approach 1:
The patent applies local quality by creating different insulating characteristics in different regions of the same chip. The first insulating element has a first dielectric strength suitable for low voltage circuits, while the second insulating element has a second dielectric strength suitable for high voltage circuits. Each region of the chip is locally optimized for its specific voltage requirement through differentiated insulating layers and conductor patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances dielectric voltage performance and reduces manufacturing costs by utilizing a common insulating chip for both low and high voltage circuits, improving signal transmission and reducing the need for multiple types of gate drivers.
Implementation Method 1
an insulating layer formed on the substrate, a first insulating element including a first conductor and a second conductor embedded into the insulating layer and arranged to face each other
Implementation Method 2
The low voltage circuit and the high voltage circuit are connected through the first insulating element and the second insulating element connected to each other in series and are configured to transmit signals through the first insulating element and the second insulating element
Data Source
AI summary
Provided is a gate driver that applies a gate voltage to a gate of a switching element, the gate driver including a low voltage circuit that operates when a first voltage is applied, a high voltage circuit that operates when a second voltage is applied, and an insulating chip, in which the insulating chip includes a substrate, an insulating layer, a first insulating element including a first conductor and a second conductor embedded into the insulating layer and arranged to face each other, and a second insulating element including a third conductor and a fourth conductor embedded into the insulating layer and arranged to face each other, and the low voltage circuit and the high voltage circuit are connected through the first insulating element and the second insulating element connected to each other in series and are configured to transmit signals through the first and second insulating elements.