Insulating Circuit Board Buffer Material for Thermal Stress Mitigation
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Solution Overview
Problem
The reliability of semiconductor devices is compromised due to stress caused by differential thermal expansion between the insulating plate, circuit patterns, and metal plate in the insulating circuit board, leading to potential peeling and damage.
Innovation Solution
A semiconductor device design that includes an insulating circuit board with circuit patterns having gaps and a buffer material containing resin applied at corner areas to buffer stress caused by thermal expansion, reducing the likelihood of cracks and peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the insulating plate, circuit patterns, and metal plate are directly bonded without buffer material, then the manufacturing process is simple, but stress occurs due to differential thermal expansion causing peeling and damage
Solution Approach 1:
A buffer material containing resin is introduced as an intermediary substance between the circuit patterns and the insulating plate. This buffer material absorbs and mitigates the stress generated by differential thermal expansion between components with different linear expansion coefficients, preventing direct stress transmission that would cause peeling or damage while maintaining manufacturing simplicity
Solution Approach 2:
The buffer material changes the mechanical parameters of the bonding interface by providing a compliant layer that can deform under thermal stress. This parameter change allows the system to accommodate differential expansion without transmitting damaging stresses to the circuit patterns or insulating plate
2Reliability
If buffer material is applied at corner areas of circuit patterns, then stress is effectively reduced preventing peeling and damage, but the manufacturing process becomes more complex
Solution Approach 1:
The buffer material is applied selectively at the corner areas of circuit patterns where stress concentration occurs during thermal expansion. This localized application provides stress relief precisely where needed most, while avoiding unnecessary material application in low-stress areas, thus balancing reliability improvement with manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer material effectively reduces stress and prevents damage to the insulating circuit board, enhancing the reliability of the semiconductor device by mitigating thermal expansion-induced issues.
Implementation Method 1
the insulating plate, the circuit patterns, and the metal plate of the insulating circuit board each have a different linear expansion coefficient. When the heat generated by a semiconductor chip is transferred to the insulating circuit board, the insulating plate, the corresponding circuit pattern, and the metal plate expand differently depending on the differences among the linear expansion coefficients. Thus, stress occurs in the insulating circuit board.
Data Source
AI summary
A semiconductor device including an insulating circuit board. The insulating circuit board has an insulating plate, a plurality of circuit patterns disposed on a front surface of the insulating plate, any adjacent two of the circuit patterns having a gap therebetween, each circuit pattern having at least one corner, each corner being in a corner area that covers the corner and a portion of each gap adjacent to the corner, and a buffer material containing resin, applied at a plurality of corner areas, to fill the gaps in the plurality of corner areas.